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Intel EP4CE30F19A7N
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 193 608256 28848 324-BGA
Brands: Intel Corp
Mfr.Part #: EP4CE30F19A7N
Datasheet: EP4CE30F19A7N Datasheet (PDF)
Package/Case: FBGA-324
Product Type: Logic ICs
RoHS Status:
Stock Condition: 3102 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Cyclone® IV E Field Programmable Gate Array (FPGA) IC 193 608256 28848 324-BGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 324 | Package Category | BGA |
| Released Date | Jan 16, 2019 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP4CE30F19A7N chip is a complex programmable logic device (CPLD) manufactured by Intel (formerly Altera). It belongs to the Cyclone IV E series and offers 30,017 logic elements, 740 Kbits of embedded RAM, and various I/O interfaces. It is commonly used in applications that require medium-scale digital signal processing, such as in telecommunications, industrial automation, and automotive electronics.
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Equivalent
Some equivalent products to the EP4CE30F19A7N chip include the EP4CE22F17C6N, EP4CE22F17I7N, EP4CE30F29C7N, and EP4CE40F29C7N chips, among others. -
Features
The EP4CE30F19A7N is a Field-Programmable Gate Array (FPGA) with 29,440 Logic Elements, 594 Embedded Memory Kbits, and 266 Embedded Multipliers. It operates at a maximum of 420MHz and has 562 user I/O pins. It supports various I/O standards and has integrated PLLs for clock management. -
Pinout
The EP4CE30F19A7N is a FPGA with 484-pin count. It is a member of the Cyclone IV E series and offers 30,080 logic elements along with various features like PLLs, memory blocks, and high-speed transceivers. Its function is to provide programmable hardware capabilities for various applications such as communication systems, industrial automation, and high-end computing devices. -
Manufacturer
EP4CE30F19A7N is a field-programmable gate array (FPGA) manufactured by Altera Corporation, which is now part of Intel Corporation. Altera is a semiconductor design company specializing in programmable logic devices like FPGAs. They provide innovative solutions for a wide range of applications, including communications, industrial automation, automotive, and more. -
Application Field
The EP4CE30F19A7N is a field-programmable gate array (FPGA) device that is commonly used in various applications such as communication systems, industrial automation, robotics, video and image processing, and high-performance computing. It offers high-density and high-performance capabilities, making it suitable for a wide range of applications. -
Package
The EP4CE30F19A7N chip comes in a package type of BGA (Ball Grid Array) form, with a size of 19mm x 19mm.
Datasheet PDF
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365 days quality guarantee for all products
Not the highest quality components but they got the job done.