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XC7Z100-2FFG900I

Cortex-A9 800MHz embedded system-on-chip with 900FCBGA packaging

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC7Z100-2FFG900I

Datasheet: XC7Z100-2FFG900I Datasheet (PDF)

Package/Case: FBGA-900

Product Type: SoC FPGA

RoHS Status:

Stock Condition: 6554 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC7Z100-2FFG900I General Description

The XC7Z100-2FFG900I is a member of the Xilinx 7 series of FPGAs, specifically the Zynq-7000 family. It features a dual-core ARM Cortex-A9 processor along with programmable logic. The device is built on a 28nm process technology, providing a good balance between performance and power efficiency.The XC7Z100-2FFG900I has a total of 101,440 logic cells and 5,520 slices, making it suitable for a wide range of applications, from industrial automation to aerospace and defense. It also includes 240 DSP slices, which can be utilized for high-performance signal processing tasks.This FPGA has 900 user I/Os, providing ample flexibility for connecting to external devices and peripherals. The device also includes 2.1 Mb of internal memory for data storage and processing.

Features

  • XC7Z100-2FFG900I is a Zynq-7000 series SoC with a dual-core ARM Cortex-A9 processor, programmable logic fabric, and various I/O interfaces
  • It features 101,440 logic cells, 3500 slices, 900 MHz maximum operating frequency, and a variety of communication interfaces including PCIe, Gigabit Ethernet, and USB
  • Application

  • The XC7Z100-2FFG900I is typically used in high-performance applications such as wireless communication, industrial automation, automotive systems, and aerospace
  • It is well-suited for signal processing, image and video processing, and high-speed I/O interfaces due to its high processing capabilities and integrated programmable logic
  • Specifications

    Parameter Value Parameter Value
    Product Category SoC FPGA RoHS Details
    Mounting Style SMD/SMT Package / Case FBGA-900
    Core ARM Cortex A9 Number of Cores 2 Core
    Maximum Clock Frequency 766 MHz L1 Cache Instruction Memory 2 x 32 kB
    L1 Cache Data Memory 2 x 32 kB Number of Logic Elements 444000 LE
    Adaptive Logic Modules - ALMs 69350 ALM Embedded Memory 26.5 Mbit
    Number of I/Os 362 I/O Minimum Operating Temperature - 40 C
    Maximum Operating Temperature + 100 C Brand AMD / Xilinx
    Moisture Sensitive Yes Number of Logic Array Blocks - LABs 34675 LAB
    Product Type Processors - Application Specialized Series XC7Z100
    Factory Pack Quantity 1 Subcategory SOC - Systems on a Chip
    Tradename Zynq

    Shipping

    Shipping Type Ship Fee Lead Time
    DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
    Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
    UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
    TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
    EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
    REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

    Processing Time:Shipping fee depend on different zone and country.

    Payment

    Terms of payment Hand Fee
    Wire Transfer Wire Transfer charge US$30.00 banking fee.
    Paypal Paypal charge 4.0% service fee.
    Credit Card Credit Card charge 3.5% service fee.
    Western Union Western Union charge US.00 banking fee.
    Money Gram Money Gram charge US$0.00 banking fee.

    Guarantees

    1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

    2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

    Packing

    • Product

      Step1 :Product

    • Vacuum packaging

      Step2 :Vacuum packaging

    • Anti-static bag

      Step3 :Anti-static bag

    • Individual packaging

      Step4 :Individual packaging

    • Packaging boxes

      Step5 :Packaging boxes

    • bar-code shipping tag

      Step6 :bar-code shipping tag

    All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

    Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

    We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

    After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

    • ESD
    • ESD

    Part points

    • The XC7Z100-2FFG900I is a high-performance system-on-chip (SoC) from Xilinx, featuring a dual-core ARM Cortex-A9 processor and programmable logic in a single device. It offers a wide range of features and peripherals for applications in communications, industrial automation, and automotive industries.
    • Equivalent

      Some equivalent products of the XC7Z100-2FFG900I chip include the XC7Z100-2FFG900C and XC7Z100-2FFG900I models from Xilinx, as well as the Altera Arria 10 GX 1150 and Intel Stratix 10 GX 1150 chips. These chips have similar capabilities and features, making them suitable replacements for the XC7Z100-2FFG900I.
    • Features

      1. Dual-core ARM Cortex-A9 processor 2. 1.0 GHZ clock speed 3. 28nm technology 4. Programmable logic with 101440 LUTs 5. 525Kb BRAM 6. 855 DSP slices 7. 6.6Mb of block RAM 8. 1Gbps Ethernet MACs 9. Advanced memory controller 10. PCI Express Gen2 endpoint host/device ports.
    • Pinout

      XC7Z100-2FFG900I is a Xilinx Zynq-7000 series SoC with 900-pin FFG package. It features 155K logic cells, 6.9Mb RAM, 360 DSP slices, and dual ARM Cortex-A9 processors. The pin count consists of power/gnd pins, configuration pins, I/O pins, and dedicated interfaces for peripherals like UART, SPI, I2C, GPIO, Ethernet, and PCIe.
    • Manufacturer

      The XC7Z100-2FFG900I is manufactured by Xilinx, which is a leading American company specializing in the design and development of field-programmable gate arrays (FPGAs) and programmable logic devices. Xilinx provides innovative programmable solutions for a wide range of applications in industries such as telecommunications, automotive, industrial, and aerospace.
    • Application Field

      The XC7Z100-2FFG900I is commonly used in applications such as automotive, industrial automation, aerospace, and defense due to its high performance capabilities and flexibility. It is also utilized in medical imaging, telecommunications, and video processing applications that require advanced signal processing and data processing capabilities.
    • Package

      The XC7Z100-2FFG900I chip is packaged in a ball grid array (BGA) form with a size of 35 mm x 35 mm.

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