XC7Z100-2FFG900I
Cortex-A9 800MHz embedded system-on-chip with 900FCBGA packaging
Brands: Amd
Mfr.Part #: XC7Z100-2FFG900I
Datasheet: XC7Z100-2FFG900I Datasheet (PDF)
Package/Case: FBGA-900
Product Type: SoC FPGA
RoHS Status:
Stock Condition: 6554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7Z100-2FFG900I General Description
The XC7Z100-2FFG900I is a member of the Xilinx 7 series of FPGAs, specifically the Zynq-7000 family. It features a dual-core ARM Cortex-A9 processor along with programmable logic. The device is built on a 28nm process technology, providing a good balance between performance and power efficiency.The XC7Z100-2FFG900I has a total of 101,440 logic cells and 5,520 slices, making it suitable for a wide range of applications, from industrial automation to aerospace and defense. It also includes 240 DSP slices, which can be utilized for high-performance signal processing tasks.This FPGA has 900 user I/Os, providing ample flexibility for connecting to external devices and peripherals. The device also includes 2.1 Mb of internal memory for data storage and processing.
Features
Application
Specifications
Parameter | Value | Parameter | Value |
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Product Category | SoC FPGA | RoHS | Details |
Mounting Style | SMD/SMT | Package / Case | FBGA-900 |
Core | ARM Cortex A9 | Number of Cores | 2 Core |
Maximum Clock Frequency | 766 MHz | L1 Cache Instruction Memory | 2 x 32 kB |
L1 Cache Data Memory | 2 x 32 kB | Number of Logic Elements | 444000 LE |
Adaptive Logic Modules - ALMs | 69350 ALM | Embedded Memory | 26.5 Mbit |
Number of I/Os | 362 I/O | Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 100 C | Brand | AMD / Xilinx |
Moisture Sensitive | Yes | Number of Logic Array Blocks - LABs | 34675 LAB |
Product Type | Processors - Application Specialized | Series | XC7Z100 |
Factory Pack Quantity | 1 | Subcategory | SOC - Systems on a Chip |
Tradename | Zynq |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7Z100-2FFG900I is a high-performance system-on-chip (SoC) from Xilinx, featuring a dual-core ARM Cortex-A9 processor and programmable logic in a single device. It offers a wide range of features and peripherals for applications in communications, industrial automation, and automotive industries.
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Equivalent
Some equivalent products of the XC7Z100-2FFG900I chip include the XC7Z100-2FFG900C and XC7Z100-2FFG900I models from Xilinx, as well as the Altera Arria 10 GX 1150 and Intel Stratix 10 GX 1150 chips. These chips have similar capabilities and features, making them suitable replacements for the XC7Z100-2FFG900I. -
Features
1. Dual-core ARM Cortex-A9 processor 2. 1.0 GHZ clock speed 3. 28nm technology 4. Programmable logic with 101440 LUTs 5. 525Kb BRAM 6. 855 DSP slices 7. 6.6Mb of block RAM 8. 1Gbps Ethernet MACs 9. Advanced memory controller 10. PCI Express Gen2 endpoint host/device ports. -
Pinout
XC7Z100-2FFG900I is a Xilinx Zynq-7000 series SoC with 900-pin FFG package. It features 155K logic cells, 6.9Mb RAM, 360 DSP slices, and dual ARM Cortex-A9 processors. The pin count consists of power/gnd pins, configuration pins, I/O pins, and dedicated interfaces for peripherals like UART, SPI, I2C, GPIO, Ethernet, and PCIe. -
Manufacturer
The XC7Z100-2FFG900I is manufactured by Xilinx, which is a leading American company specializing in the design and development of field-programmable gate arrays (FPGAs) and programmable logic devices. Xilinx provides innovative programmable solutions for a wide range of applications in industries such as telecommunications, automotive, industrial, and aerospace. -
Application Field
The XC7Z100-2FFG900I is commonly used in applications such as automotive, industrial automation, aerospace, and defense due to its high performance capabilities and flexibility. It is also utilized in medical imaging, telecommunications, and video processing applications that require advanced signal processing and data processing capabilities. -
Package
The XC7Z100-2FFG900I chip is packaged in a ball grid array (BGA) form with a size of 35 mm x 35 mm.
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