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Xilinx XC7K325T-1FBG676C
FPGA - Field Programmable Gate Array XC7K325T-1FBG676C
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K325T-1FBG676C
Datasheet: XC7K325T-1FBG676C Datasheet (PDF)
Package/Case: BGA676
Product Type: Programmable Logic ICs
XC7K325T-1FBG676C General Description
FPGA, KINTEX-7, 400 I/O, FCBGA-676; No. of Logic Blocks:50950; No. of Macrocells:326080Macrocells; FPGA Family:Kintex-7; Logic Case Style:FCBGA; No. of Pins:676Pins; No. of Speed Grades:1; Total RAM Bits:16020Kbit; MSL:- RoHS Compliant: Yes
Features
- Contains 325,200 logic cells
- Offers 12.5 Gb/s transceivers
- Provides up to 1200 DSP slices
- Has up to 3.8 Mb of block RAM
- Offers up to 1.6 million system logic cells
Application
- XC7K325T-1FFG900C
- XC7K325T-1FBG900C
- XC7K325T-1FFG676I
- XC7K325T-1FBG676I
- XC7K325T-1FFG900I
- XC7K325T-1FBG900I
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 676 | Package Category | BGA |
| Released Date | Mar 17, 2020 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7K325T-1FBG676C chip is a member of Xilinx's 7 series FPGAs. It offers a high level of processing power and programmability. With its 325,000 logic cells, this chip is suitable for a wide range of applications including aerospace, defense, and telecommunications. The FBG676C package features 676 pins making it compatible with various PCB layouts. Overall, this chip provides a versatile and efficient solution for complex digital system designs.
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Equivalent
Some equivalent products of the XC7K325T-1FBG676C chip include the XC7K325T-1FFG676I, XC7K325T-1FFG676C, and XC7K325T-1FFG676E chips. -
Features
The XC7K325T-1FBG676C is a field-programmable gate array (FPGA) with a capacity of 325,000 logic cells and 1,800 DSP slices. It operates at a maximum speed of 1.066 GHz, has 2400Kb of block RAM, and supports various I/O standards. This particular model is housed in a FBG676 package. -
Pinout
The XC7K325T-1FBG676C is a Field Programmable Gate Array (FPGA) with 676 Ball Grid Array (BGA) packaging. It has a pin count of 676. The function of the device is to provide programmable logic and I/O capabilities for implementation of digital circuits in various applications. -
Manufacturer
Xilinx is the manufacturer of the XC7K325T-1FBG676C. It is a technology company specializing in field-programmable gate arrays (FPGA) and programmable logic devices. -
Application Field
The XC7K325T-1FBG676C is a field-programmable gate array (FPGA) that can be used in various applications such as telecommunications, aerospace and defense, automotive, industrial control, and scientific research. It provides high-performance processing capabilities and programmable logic, making it suitable for complex and demanding tasks in these fields. -
Package
The XC7K325T-1FBG676C chip has a Ball Grid Array (BGA) package type, a 676-pin grid array form, and a size of 27 mm x 27 mm.
Datasheet PDF
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