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Xilinx XC3S400-4FT256I
Spartan®-3 Field Programmable Gate Array (FPGA) IC 173 294912 8064 256-LBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S400-4FT256I
Datasheet: XC3S400-4FT256I Datasheet (PDF)
Package/Case: BGA256
RoHS Status:
Stock Condition: 3069 pcs, New Original
Product Type: Programmable Logic ICs
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $98.009 | $98.009 |
| 200 | $37.929 | $7585.800 |
| 500 | $36.597 | $18298.500 |
| 1000 | $35.938 | $35938.000 |
In Stock:3069 PCS
XC3S400-4FT256I General Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 173 294912 8064 256-LBGA
Features
- 400,000 system gates
- 576 macrocells
- 18,432 logic cells
- 36 Digital Signal Processing (DSP) slices
- 2,592 kilobits of block RAM
- Up to 622 Mbps data transfer rate
- 4 input/output standards (LVCMOS, LVTTL, PCI, HSTL)
Application
- Digital signal processing
- Wired and wireless communications
- Industrial automation
- Automotive systems
- Consumer electronics
- Aerospace and defense
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pbfree Code | No | Rohs Code | No |
| Part Life Cycle Code | Transferred | Ihs Manufacturer | XILINX INC |
| Part Package Code | BGA | Package Description | 17 X 17 MM, FTBGA-256 |
| Pin Count | 256 | Reach Compliance Code | not_compliant |
| ECCN Code | EAR99 | HTS Code | 8542.39.00.01 |
| Factory Lead Time | 32 Weeks | Samacsys Manufacturer | XILINX |
| Clock Frequency-Max | 630 MHz | Combinatorial Delay of a CLB-Max | 0.61 ns |
| JESD-30 Code | S-PBGA-B256 | JESD-609 Code | e0 |
| Length | 17 mm | Moisture Sensitivity Level | 3 |
| Number of CLBs | 896 | Number of Equivalent Gates | 400000 |
| Number of Inputs | 173 | Number of Logic Cells | 8064 |
| Number of Outputs | 173 | Number of Terminals | 256 |
| Operating Temperature-Max | 100 °C | Operating Temperature-Min | -40 °C |
| Organization | 896 CLBS, 400000 GATES | Package Body Material | PLASTIC/EPOXY |
| Package Code | LBGA | Package Equivalence Code | BGA256,16X16,40 |
| Package Shape | SQUARE | Package Style | GRID ARRAY, LOW PROFILE |
| Peak Reflow Temperature (Cel) | 225 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified | Seated Height-Max | 1.55 mm |
| Supply Voltage-Max | 1.26 V | Supply Voltage-Min | 1.14 V |
| Supply Voltage-Nom | 1.2 V | Surface Mount | YES |
| Technology | CMOS | Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN LEAD | Terminal Form | BALL |
| Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S400-4FT256I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S400-4PQ208C
Brands :
Package : QFP208
Description : FPGA, 896 CLBS, 400000 GATES, 630 MHZ, PQFP208
Part Number : XC3S400-5TQ144C
Brands :
Package : TQFP144
Description : 400000 SYSTEM GATE 1.2 VOLT FPGA
Part Number : XC3S400-4PQG208C
Brands :
Package : QFP208
Description : 400K Gates 8064 Cells 630MHz 90nm Technology 1.2V
Part Number : XC3S400-4TQG144I
Brands :
Package : TQFP-144
Description : Spartan®-3 Family 400K Gates 8064 Cells 630MHz 90nm Technology 1.2V
Part points
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The XC3S400-4FT256I chip is an FPGA (Field-Programmable Gate Array) produced by Xilinx. It has a capacity of 400K system gates and offers 4,608 configurable logic blocks. The chip operates at a maximum frequency of 550MHz. It has 256 pins and comes in a FT256 package. TheXC3S400-4FT256I chip is commonly used in various electronic applications such as telecommunications, industrial control, and automotive systems.
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Equivalent
Some equivalent products of the XC3S400-4FT256I chip include XC3S400-5FGG900C, XC3S400A-4FT256I, and XC3S400A-4FTG256C. -
Features
The XC3S400-4FT256I is an FPGA device with a capacity of 400K system gates. It operates at a speed of up to 400 MHz and has 32,640 logic cells and 1,088 Kbits of block RAM. It also features integrated peripheral blocks such as multipliers and DSP slices, as well as support for advanced I/O standards. -
Pinout
The XC3S400-4FT256I is a field-programmable gate array (FPGA) with a pin count of 256. It has various functions, including programmable logic cells, input/output blocks, clock management, and memory. It is designed for high-performance applications such as digital signal processing, communication, and embedded processing. -
Manufacturer
The manufacturer of the XC3S400-4FT256I is Xilinx. Xilinx is a multinational technology company that specializes in the development and production of programmable logic devices and related software tools. They are known for their field-programmable gate arrays (FPGAs) and system on a chip (SoC) solutions, catering to a wide range of industries such as aerospace, automotive, telecommunications, and data centers. -
Application Field
The main application areas of the XC3S400-4FT256I FPGA include industrial control systems, consumer electronics, automotive systems, and communication equipment. It can be used for tasks such as signal processing, data encryption, motor control, networking, and display management. Its versatile architecture and wide range of I/O options make it suitable for various embedded applications. -
Package
The XC3S400-4FT256I chip is in a 256-pin fine-pitch ball grid array (FBGA) package. It has a size of 17mm x 17mm.
Datasheet PDF
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