Xilinx XC3S200A-4FGG320C
FPGA - Field Programmable Gate Array XC3S200A-4FGG320C
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S200A-4FGG320C
Datasheet: XC3S200A-4FGG320C Datasheet (PDF)
Package/Case: BGA320
RoHS Status:
Stock Condition: 2756 pcs, New Original
Product Type: Programmable Logic ICs
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $23.684 | $23.684 |
30 | $22.674 | $680.220 |
In Stock:2756 PCS
XC3S200A-4FGG320C General Description
FPGA, SPARTAN-3A, 200K ELE, 320FBGA; Programmable Logic Type:FPGA; Logic IC Function:FPGA; Logic IC Base Number:3S200; No of I/O Lines:248; No. of Macrocells:4032; Frequency:250MHz; I/O Interface Standard:LVTTL, LVCMOS, PCI, HSTL, SSTL; Voltage, Supply Min:1.14V; Voltage, Supply Max:1.26V; Case Style:FBGA; Operating Temperature Range:0°C to +85°C; No. of Pins:320; Termination Type:SMD
Features
- It has 200,000 system gates, which means it can implement complex digital circuits.
- It has 348 input/output (I/O) pins, which can be used to interface with external devices.
- It operates at a maximum frequency of 400 MHz, which means it can perform millions of operations per second.
- It has 320 pins in a Fine-Pitch Ball-Grid Array (FBGA) package, which allows for high-density mounting on a printed circuit board (PCB).
- It operates at a supply voltage of 1.2V, which means it consumes less power.
Application
- Communications: It can be used to implement high-speed interfaces such as Gigabit Ethernet, USB, and HDMI.
- Digital signal processing: It can be used to implement digital filters, modulators, and demodulators.
- Industrial control: It can be used to implement control algorithms for manufacturing equipment, robotics, and process control.
- Aerospace and defense: It can be used to implement high-performance radar and communication systems.
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Case/Package | FBGA | Mount | Surface Mount |
Number of Pins | 320 | Frequency | 250 MHz |
Max Operating Temperature | 85 °C | Max Supply Voltage | 1.26 V |
Min Operating Temperature | 0 °C | Min Supply Voltage | 1.14 V |
Number of Gates | 200000 | Number of I/Os | 248 |
Number of Logic Blocks (LABs) | 448 | Number of Logic Elements/Cells | 4032 |
Number of Macrocells | 4032 | Operating Supply Voltage | 1.2 V |
RAM Size | 36 kB | Speed Grade | 4 |
Termination | SMD/SMT |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S200A-4FGG320C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : EP3C25F324I7N
Brands :
Package : FBGA-324
Description : FPGA Cyclone® III Family 24624 Cells 437.5MHz 65nm Technology 1.2V
Part Number : A3P1000-2FGG484
Brands :
Package : 484-BGA
Description : FPGA ProASIC®3 Family 1M Gates 310MHz 130nm Technology 1.5V 484Pin FBGA
Part Number : LCMXO3LF-2100E-6MG324C
Brands : Lattice Semiconductor
Package :
Description :
Part Number : FG400-10CS484I
Brands :
Package :
Description : by Achronix Semiconductor
Part points
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The XC3S200A-4FGG320C is a field-programmable gate array (fpga) chip manufactured by xilinx. it belongs to the spartan-3a fpga family and has 200,000 system gates. with a maximum capacity of 4 million system gates, it offers programmable logic, digital signal processing (dsp), and embedded memory capabilities. the chip operates at a speed of up to 500 mhz and is commonly used in various applications like telecommunications, automotive, and industrial systems.
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Equivalent
Some equivalent products to the XC3S200A-4FGG320C chip are the xc3s200a-4ftg256c and the xc3s200a-4vqg100c. -
Features
XC3S200A-4FGG320C is an fpga device from xilinx. it has a spartan-3a architecture, 200,000 system gates, 3232 clb slices, 202 i/o pins, and 3.75ns input-output delay. it operates at a maximum frequency of 400mhz and supports configuration via external prom or internal sram. it is designed for low-power applications and offers various features for digital logic design and implementation. -
Pinout
The XC3S200A-4FGG320C is a field programmable gate array (fpga) with 320 pins. it is manufactured by xilinx and offers 200,000 system gates. the pin count refers to the number of physical pins on the device, while the function of the fpga includes customizable logic, memory, and input/output interfaces for various applications. -
Manufacturer
The XC3S200A-4FGG320C is manufactured by xilinx, inc. it is a leading technology company specializing in the field of programmable logic devices and software tools. -
Application Field
The XC3S200A-4FGG320C is a field-programmable gate array (fpga) that can be used in various application areas such as telecommunications, automotive, aerospace, industrial automation, and consumer electronics. it is commonly used for digital signal processing, high-speed data processing, networking equipment, image and video processing, and control systems. -
Package
The XC3S200A-4FGG320C chip has a package type of csg320, form factor of bga and a size of 17 x 17 mm.
Datasheet PDF
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