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Xilinx XC3090-70PP175C

FPGA XC3000 Family 6K Gates 320 Cells 70MHz 5V 175-Pin PPGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3090-70PP175C

Datasheet: XC3090-70PP175C Datasheet (PDF)

Package/Case: PGA176

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2312 pcs, New Original

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XC3090-70PP175C General Description

XC3090-70PP175C is a field-programmable gate array (FPGA) chip from the Xilinx Virtex-II family. It was introduced in the early 2000s and has since been discontinued.

xc3090-70pp175c

Features

  • 70,000 logic cells
  • 4,800 Kbits of block RAM
  • 144 digital signal processing (DSP) slices
  • 8 Digital Clock Managers (DCMs)
  • 12 Delay Locked Loops (DLLs)
  • Up to 622 Mb/s data rate per I/O
xc3090-70pp175c

Application

  • Telecommunications and networking equipment
  • Digital signal processing and image processing
  • Industrial control and automation
  • Military and aerospace systems
  • Medical equipment
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Specifications

Parameter Value Parameter Value
Manufacturer XILINX Product Category IC Chips
Tags XC3090-70P, XC3090-70, XC3090-7, XC3090, XC309, XC30, XC3

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3090-70PP175C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC2V1000-4FG456C

Brands :  

Package :   BGA456

Description :   Virtex-II 1.5V Field-Programmable Gate Arrays FPGA

Part Number :   XC2V1500-5FF896C

Brands :  

Package :   FCBGA-896

Description :   Virtex-II 1.5V Field-Programmable Gate Arrays

Part Number :   XC2V2000-5FF896C

Brands :  

Package :   BGA-896

Description :   Virtex-II 1.5V Field-Programmable Gate Arrays

Part Number :   XC3S100E-4VQ100C

Brands :  

Package :   QFP100

Description :   100K Gates 2160 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S200-4PQG208C

Brands :  

Package :   208-BFQFP

Description :   FPGA Spartan®-3 Family 200K Gates 4320 Cells 630MHz 90nm Technology 1.2V

Part points

  • The XC3090-70PP175C chip is a field-programmable gate array (FPGA) produced by Xilinx. It belongs to the XC3000 series and operates at a clock frequency of 70 MHz. The chip has a capacity of 175,000 system gates and is suitable for applications that require programmable logic devices with moderate complexity and high performance.
  • Equivalent

    There are no direct equivalent products for the XC3090-70PP175C chip. However, there may be similar programmable logic devices (PLDs) available from Xilinx or other manufacturers with comparable features and specifications.
  • Features

    The XC3090-70PP175C is a programmable logic device by Xilinx. It is a 3D IC with 1.95 million system gates and 7,600 CLB flip-flops. It features abundant RAM and high-performance digital signal processing capabilities with a maximum operating frequency of 65 MHz. The device is commonly used in applications like telecommunications, aerospace, and defense.
  • Pinout

    The XC3090-70PP175C is a field-programmable gate array (FPGA) with a pin count of 175. The functions of the pins vary depending on the specific configuration and design of the FPGA.
  • Manufacturer

    The manufacturer of the XC3090-70PP175C is Xilinx. Xilinx is an American technology company that specializes in the design and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). They are known for their high-performance and flexible solutions for a wide range of applications in various industries such as aerospace, automotive, telecommunications, and data centers.
  • Application Field

    The XC3090-70PP175C is primarily used in industrial applications such as automation, motor control, and device connectivity. It is commonly utilized in control systems, robotics, and networking equipment to enable high-performance processing, real-time operation, and reliable communication capabilities.

Datasheet PDF

Preliminary Specification XC3090-70PP175C PDF Download

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