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TI UCC27424MDGNREP

Name: UCC27424MDGNREP
Rating: 4.5 (10 reviews)

Low-Side Gate Driver IC Non-Inverting 8-HVSSOP

Brands: TI

Mfr.Part #: UCC27424MDGNREP

Datasheet: UCC27424MDGNREP Datasheet (PDF)

Package/Case: HVSSOP-8

Product Type: MOSFET & Power Driver ICs

RoHS Status:

Stock Condition: 2000 pcs, New Original

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UCC27424MDGNREP General Description

The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.

Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to V_DD for active-high logic and can be left open for standard operation.

Features

Industry-Standard Pinout
Enable Functions for Each Driver
High Current-Drive Capability of ±4 A
Unique Bipolar and CMOS True-Drive Output
Stage Provides High Current at MOSFET Miller
Thresholds
TTL-/CMOS-Compatible Inputs Independent of
Supply Voltage
20-ns Typical Rise and 15-ns Typical Fall Times
With 1.8-nF Load
Typical Propagation Delay Times of 25 ns
With Input Falling and 35 ns With Input Rising
4.5-V to 15-V Supply Voltage
Dual Outputs can be Paralleled for Higher Drive
Current
Available in Thermally-Enhanced MSOP
PowerPAD™ Package With 4.7°C/W R_θJC
Supports Defense, Aerospace, and Medical
Applications
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
APPLICATIONS
- Switch-Mode Power Supplies
- DC/DC Converters
- Motor Controllers
- Line Drivers
- Class-D Switching Amplifiers

All other trademarks are the property of their respective owners

Specifications

Parameter	Value	Parameter	Value
Number of channels	2	Power switch	IGBT, MOSFET
Peak output current (A)	4	Input VCC (min) (V)	4.5
Input VCC (max) (V)	15	Features	Enable pin
Operating temperature range (°C)	-55 to 125	Rise time (ns)	20
Fall time (ns)	15	Propagation delay time (µs)	0.025
Input negative voltage (V)	0	Rating	HiRel Enhanced Product
Driver configuration	Dual inputs

Shipping

	Ship Fee	Lead Time
DHL	$20.00-$40.00 (0.50 KG)	2-5 days
Fedex	$20.00-$40.00 (0.50 KG)	2-5 days
UPS	$20.00-$40.00 (0.50 KG)	2-5 days
TNT	$20.00-$40.00 (0.50 KG)	2-5 days
EMS	$20.00-$40.00 (0.50 KG)	2-5 days
REGISTERED AIR MAIL	$20.00-$40.00 (0.50 KG)	2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment		Hand Fee
	Wire Transfer	charge US$30.00 banking fee.
	Paypal	charge 4.0% service fee.
	Credit Card	charge 3.5% service fee.
	Western Union	charge US.00 banking fee.
	Money Gram	charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

Step1 :Product
Step2 :Vacuum packaging
Step3 :Anti-static bag
Step4 :Individual packaging
Step5 :Packaging boxes
Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Part points

The UCC27424MDGNREP chip is a high-speed, dual-channel gate driver designed for driving power MOSFETs and IGBTs in applications like motor control and power supplies. It offers high peak output current and fast switching speeds, enhancing system efficiency and reliability. Additionally, its small form factor and robust design make it suitable for various industrial and automotive applications.
Equivalent

Equivalent products to the UCC27424MDGNREP chip include the UCC27423, UCC27425, and UCC27426 from Texas Instruments. These devices are high-speed, dual-channel MOSFET drivers with similar specifications and features.
Features

UCC27424MDGNREP is a dual-channel, high-speed, low-side gate driver with 4-A source and sink current capabilities. It features TTL input thresholds, wide supply voltage range, matched propagation delays, and an active Miller clamp. It is suitable for use in high-frequency switching applications in power electronics.
Pinout

The UCC27424MDGNREP is a dual-channel, high-speed, low-side gate driver IC. It has 8 pins and functions to efficiently drive power MOSFETs and IGBTs in high-frequency switching applications. The pins include input, output, and supply connections for each channel, along with ground and enable pins.
Manufacturer

Texas Instruments is the manufacturer of the UCC27424MDGNREP. It is an American company that designs and manufactures semiconductors and integrated circuits for a variety of applications, including power management, analog, and digital signal processing.
Application Field

The UCC27424MDGNREP is commonly used in applications requiring high-speed, high-current drive capabilities, such as power inverters, motor control, switch-mode power supplies, and DC-DC converters. Its features make it suitable for various power electronics applications where fast and efficient switching is crucial.
Package

The UCC27424MDGNREP chip comes in a Surface Mount Package. It has a 14-Pin SOIC (Small Outline Integrated Circuit) form factor. The size of the chip is 5mm x 5mm.