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TI TLV9002IDDFR

Operational Amplifier

ISO14001 ISO9001 DUNS

Brands: Texas Instruments

Mfr.Part #: TLV9002IDDFR

Datasheet: TLV9002IDDFR Datasheet (PDF)

Package/Case: SOT-23-THN (DDF)-8

Product Type: Amplifier ICs

RoHS Status:

Stock Condition: 2900 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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TLV9002IDDFR General Description

The TLV9002IDDFR is a dual operational amplifier from Texas Instruments with a DFN-8 surface-mount package. It features low offset voltage of 0.5 mV, low noise of 19 nV/√Hz, and a wide supply voltage range of 1.8V to 5.5V. The amplifier offers a high bandwidth of 10 MHz and a slew rate of 5 V/µs, making it suitable for applications requiring fast signal processing.This device is designed for precision applications like sensor conditioning, active filters, transducer amplifiers, and data acquisition systems. It is equipped with EMI filters to enhance electromagnetic compatibility and ensure reliable operation in noisy environments. The TLV9002IDDFR also has thermal shutdown protection to prevent damage from overheating.

TLV9002IDDFR

Features

  • The TLV9002IDDFR is a dual operational amplifier with rail-to-rail input and output
  • It has a low offset voltage, low noise, and low quiescent current
  • It is designed for precision low-power applications and has a wide supply voltage range
  • It is available in a small DDF package
  • TLV9002IDDFR

    Application

  • The TLV9002IDDFR is a low-power operational amplifier that is commonly used in a variety of applications including sensor interfaces, portable devices, and battery-powered equipment
  • It is also suitable for signal conditioning, low-power instrumentation, and audio amplification due to its high bandwidth and low input bias current
  • Specifications

    Parameter Value Parameter Value
    Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5
    Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out
    GBW (typ) (MHz) 1 Slew rate (typ) (V/µs) 2
    Vos (offset voltage at 25°C) (max) (mV) 1.5 Iq per channel (typ) (mA) 0.06
    Vn at 1 kHz (typ) (nV√Hz) 30 Rating Catalog
    Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 0.6
    Features Cost Optimized, EMI Hardened, Shutdown, Small Size CMRR (typ) (dB) 90
    Iout (typ) (A) 0.04 Architecture CMOS
    Input common mode headroom (to negative supply) (typ) (V) -0.1 Input common mode headroom (to positive supply) (typ) (V) 0.1
    Output swing headroom (to negative supply) (typ) (V) 0.01

    Shipping

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    Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
    UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
    TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
    EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
    REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

    Processing Time:Shipping fee depend on different zone and country.

    Payment

    Terms of payment Hand Fee
    Wire Transfer Wire Transfer charge US$30.00 banking fee.
    Paypal Paypal charge 4.0% service fee.
    Credit Card Credit Card charge 3.5% service fee.
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    Guarantees

    1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

    2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

    Packing

    • Product

      Step1 :Product

    • Vacuum packaging

      Step2 :Vacuum packaging

    • Anti-static bag

      Step3 :Anti-static bag

    • Individual packaging

      Step4 :Individual packaging

    • Packaging boxes

      Step5 :Packaging boxes

    • bar-code shipping tag

      Step6 :bar-code shipping tag

    All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

    Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

    We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

    After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

    • ESD
    • ESD

    Part points

    • The TLV9002IDDFR is a chip that belongs to the TLV9002 series of operational amplifiers designed by Texas Instruments. It is a dual-channel, rail-to-rail input and output amplifier with a low quiescent current consumption. The chip is ideal for battery-powered and portable applications, offering a wide input voltage range and excellent performance in terms of speed, precision, and power efficiency.
    • Equivalent

      Some equivalent products of the TLV9002IDDFR chip include the TLV9002IDDBVR, TLV9002IDR, and TLV9002IDBVR.
    • Features

      The TLV9002IDDFR is a dual-channel, low-power operational amplifier. It offers rail-to-rail input/output, operates from a single 1.8 V to 5.5 V power supply, and consumes ultra-low quiescent current. It has low input bias current, low offset voltage, and is designed for applications where low power and precision are required in portable devices and battery-powered electronics.
    • Pinout

      The TLV9002IDDFR is a dual operational amplifier integrated circuit. It has 8 pins with the following functions: pins 1 and 5 are inputs of amplifier 1, pins 2 and 6 are outputs of amplifier 1, pins 3 and 7 are inputs of amplifier 2, and pins 4 and 8 are outputs of amplifier 2.
    • Manufacturer

      The manufacturer of the TLV9002IDDFR is Texas Instruments. Texas Instruments is a multinational semiconductor company that designs and manufactures various integrated circuits and electronic components for a wide range of applications.
    • Application Field

      The TLV9002IDDFR is a low-power, low-voltage operational amplifier. It is commonly used in applications where low power consumption and low voltage operation is required, such as battery-powered devices, portable instruments, and low-power sensors. It can also be used in automotive electronics and industrial control systems.
    • Package

      The TLV9002IDDFR chip is a surface-mount package type. Its form is Dual and its size is an 8-pin VSSOP package.

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