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TI TLV274CDR

General Purpose Amplifier 4 Circuit Rail-to-Rail 14-SOIC

ISO14001 ISO9001 DUNS

Brands: TI

Mfr.Part #: TLV274CDR

Datasheet: TLV274CDR Datasheet (PDF)

Package/Case: SOP14

Product Type: Instrumentation, OP Amps, Buffer Amps

RoHS Status:

Stock Condition: 228 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for TLV274CDR or email to us: Email: [email protected], we will contact you within 12 hours.

TLV274CDR General Description

Operating from 2.7 V to 16 V over the extended industrial temperature range from –40°C to +125°C, the TLV27x is a low power, wide bandwidth operational amplifier (opamp) with rail to rail output. This makes it an ideal alternative to the TLC27x family for applications where rail-to-rail output swings are essential. The TLV27x provides 3-MHz bandwidth from only 550 µA.

Like the TLC27x, the TLV27x is fully specified for 5-V and ±5-V supplies. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from a variety of rechargeable cells (±8 V supplies down to ±1.35 V).

The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an attractive alternative for the TLC27x in battery-powered applications.

All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package.

The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of many micropower microcontrollers available today including TI’s MSP430.

TLV274CDR

Features

  • Rail-to-Rail Output
  • Wide Bandwidth: 3 MHz
  • High Slew Rate: 2.4 V/µs
  • Supply Voltage Range: 2.7 V to 16 V
  • Supply Current: 550 µA/Channel
  • Input Noise Voltage: 39 nV/√Hz
  • Input Bias Current: 1 pA
  • Specified Temperature Range:
    • Commercial Grade: 0°C to 70°C
    • Industrial Grade: –40°C to 125°C
  • Ultrasmall Packaging:
    • 5-Pin SOT-23 (TLV271)
    • 8-Pin MSOP (TLV272)
  • Ideal Upgrade for TLC72x Family
TLV274CDR
TLV274CDR

Specifications

Parameter Value Parameter Value
Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 16
Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Rail-to-rail In to V-, Out
GBW (typ) (MHz) 3 Slew rate (typ) (V/µs) 2.1
Vos (offset voltage at 25°C) (max) (mV) 5 Iq per channel (typ) (mA) 0.55
Vn at 1 kHz (typ) (nV√Hz) 39 Rating Catalog
Operating temperature range (°C) -40 to 125, 0 to 70 Offset drift (typ) (µV/°C) 2
Input bias current (max) (pA) 60 CMRR (typ) (dB) 80
Iout (typ) (A) 0.007 Architecture CMOS
Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) -1.35
Output swing headroom (to negative supply) (typ) (V) 0.05

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The TLV274CDR chip is an operational amplifier (op-amp) developed by Texas Instruments. It features low noise and high precision, making it suitable for a range of analog circuit applications. With a low power consumption and rail-to-rail input/output capabilities, it can operate on a single supply voltage from 2.7V to 16V. The TLV274CDR is commonly used in audio devices, communication systems, and industrial control systems.
  • Equivalent

    Some equivalent products of the TLV274CDR chip are TLV274CP, TLV274IP, and TLV274IDR.
  • Features

    TLV274CDR is a quad operational amplifier (op-amp) with rail-to-rail input and output. It has a low offset voltage, low noise, and low power consumption. It operates over a wide supply voltage range and offers high-speed performance. With these features, it is suitable for applications requiring precision and low power in a compact package.
  • Pinout

    TLV274CDR is a 14-pin integrated circuit (IC). It functions as a low-power, rail-to-rail input/output operational amplifier.
  • Manufacturer

    Texas Instruments is the manufacturer of the TLV274CDR. It is a multinational semiconductor company, specializing in the design and production of integrated circuits, including analog and digital signal processing.
  • Application Field

    The TLV274CDR is a low-power operational amplifier that can be used in various applications, including portable electronics, medical equipment, automotive systems, and industrial automation. With its low power consumption and wide supply voltage range, it is suitable for battery-powered devices and other power-constrained applications.
  • Package

    The TLV274CDR chip has a package type of SOIC (Small Outline Integrated Circuit), a form of surface mount technology. The size of the chip is in a 14-pin configuration.

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