THGBMJG6C1LBAIL
NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin WFBGA Tray
Brands: Kioxia America, Inc.
Mfr.Part #: THGBMJG6C1LBAIL
Datasheet: THGBMJG6C1LBAIL Datasheet (PDF)
Package/Case: FBGA-153
RoHS Status:
Stock Condition: 8448 pcs, New Original
Product Type: eMMC
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $4.067 | $4.067 |
10 | $3.616 | $36.160 |
30 | $3.386 | $101.580 |
152 | $2.929 | $445.208 |
456 | $2.818 | $1285.008 |
1064 | $2.771 | $2948.344 |
In Stock:8448 PCS
THGBMJG6C1LBAIL General Description
FLASH - NAND Memory IC 64Gbit eMMC 153-WFBGA (11.5x13)
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Product Status | Obsolete | Programmabe | Not Verified |
Memory Type | Non-Volatile | Memory Format | FLASH |
Technology | FLASH - NAND | Memory Size | 64Gbit |
Memory Organization | 8G x 8 | Memory Interface | eMMC |
Clock Frequency | - | Write Cycle Time - Word, Page | - |
Access Time | - | Voltage - Supply | - |
Operating Temperature | -25°C ~ 85°C (TA) | Mounting Type | Surface Mount |
Package / Case | 153-WFBGA |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The THGBMJG6C1LBAIL chip is a high-performance eMMC NAND flash memory module designed for use in various electronic devices such as smartphones, tablets, and digital cameras. It offers fast read and write speeds, high storage capacity, and low power consumption, making it ideal for storing and accessing large amounts of data in a compact form factor.
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Equivalent
The equivalent products of the THGBMJG6C1LBAIL chip are the KIOXIA BG4 series and the Western Digital SN730 series. These chips are both NVMe PCIe Gen3 x4 SSDs designed for use in laptops and ultra-thin devices, offering high performance and reliability. -
Features
1. 128GB storage capacity 2. NAND flash memory technology 3. High-speed interface (Toggle DDR) 4. Low power consumption 5. Enhanced reliability and durability 6. Wide operating temperature range 7. Suitable for mobile devices and other high-performance applications. -
Pinout
THGBMJG6C1LBAIL is a NAND flash memory chip with a pin count of 169. Its function is to store data in electronic devices such as smartphones, tablets, and laptops. -
Manufacturer
THGBMJG6C1LBAIL is a product code used by Toshiba to identify its NAND flash memory chips. Toshiba is a multinational conglomerate company based in Japan, specializing in a wide range of products and services, including electronics, semiconductors, and storage solutions. -
Application Field
The THGBMJG6C1LBAIL is commonly used in consumer electronics such as smartphones, tablets, and laptops for storing data and running applications. It is also used in automotive applications, industrial automation, and other embedded systems that require high-speed data storage and processing capabilities. -
Package
The THGBMJG6C1LBAIL chip is a BGA (Ball Grid Array) package with a form factor of 11.5mm x 13mm. Its size is 128Gbit (16GB) in capacity.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products