THGBMJG6C1LBAU7
MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit Automotive AEC-Q100 153-Pin VFBGA Tray
Brands: Kioxia America, Inc.
Mfr.Part #: THGBMJG6C1LBAU7
Datasheet: THGBMJG6C1LBAU7 Datasheet (PDF)
Package/Case: FBGA-153
RoHS Status:
Stock Condition: 9895 pcs, New Original
Product Type: eMMC
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $9.315 | $9.315 |
10 | $8.167 | $81.670 |
30 | $7.467 | $224.010 |
100 | $6.880 | $688.000 |
In Stock:9895 PCS
THGBMJG6C1LBAU7 General Description
MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit Automotive AEC-Q100 153-Pin VFBGA Tray
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Product Status | Active | Programmabe | Verified |
Memory Type | Non-Volatile | Memory Format | FLASH |
Technology | FLASH - NAND | Memory Size | 64Gbit |
Memory Organization | 8G x 8 | Memory Interface | eMMC |
Clock Frequency | - | Write Cycle Time - Word, Page | - |
Access Time | - | Voltage - Supply | - |
Operating Temperature | -40°C ~ 105°C (TA) | Mounting Type | Surface Mount |
Package / Case | 153-WFBGA |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The THGBMJG6C1LBAU7 chip is a NAND flash memory produced by Toshiba. It offers high storage capacity and fast data transfer speeds, making it suitable for various applications such as solid-state drives (SSDs), smartphones, and tablets. The chip employs advanced technology to provide reliable and efficient performance, contributing to enhanced user experiences in electronic devices.
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Equivalent
The exact equivalent products of the THGBMJG6C1LBAU7 chip from Toshiba may not be publicly disclosed. However, it is possible to find similar NAND flash memory chips from Toshiba or other manufacturers with similar specifications and features that can serve as alternatives. Professional advice from electronic component distributors or manufacturers can help in finding suitable alternatives. -
Features
THGBMJG6C1LBAU7 is a Toshiba e-MMC memory chip with the following features: it has a storage capacity of 32GB, uses the e-MMC interface for data transfer, operates at a voltage of 2.7-3.6V, offers high-speed read and write capabilities, and is designed for use in various electronic devices such as smartphones, tablets, and digital cameras. -
Pinout
The THGBMJG6C1LBAU7 is a NAND flash memory module with a pin count of 162. The pins serve various functions, including power supply, data input and output, address input, and control signals for read, write, and erase operations. -
Manufacturer
The manufacturer of the THGBMJG6C1LBAU7 is Toshiba. Toshiba is a multinational conglomerate company that specializes in electrical equipment and electronics. They produce a wide range of products, including semiconductors, digital appliances, and storage devices, such as solid-state drives (SSDs) like the THGBMJG6C1LBAU7. -
Application Field
The THGBMJG6C1LBAU7 is a high-speed, high-density NAND flash memory device commonly used in smartphones, tablets, automotive systems, and industrial applications. Its small size, high reliability, and fast data transfer make it an ideal choice for storing and retrieving data in various electronic devices. -
Package
The package type of the THGBMJG6C1LBAU7 chip is BGA (Ball Grid Array). Its form is 153-ball grid array. The chip size is 11.5mm x 13.0mm x 0.8mm.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products