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Intel TE28F128J3D75

FLASH - NOR Memory IC 128Mbit Parallel 75 ns 56-TSOP

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: TE28F128J3D75

Datasheet: TE28F128J3D75 Datasheet (PDF)

Package/Case: TSOP-56

Product Type: Integrated Circuits (ICs)

RoHS Status:

Stock Condition: 2559 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for TE28F128J3D75 or email to us: Email: [email protected], we will contact you within 12 hours.

TE28F128J3D75 General Description

FLASH - NOR Memory IC 128Mbit Parallel 75 ns 56-TSOP

te28f128j3d75

Features

  • 128 Mb density
  • Parallel interface
  • 3.3V power supply
  • Sector erase architecture
  • Erase block size of 64 Kbytes
  • Page size of 64 bytes
te28f128j3d75

Application

  • The TE28F128J3D75 flash memory can be used in a wide range of applications, including personal computers, mobile phones, digital cameras, and other consumer electronics devices.
  • It is commonly used as a storage device for firmware, BIOS, and other code that needs to be stored in a non-volatile memory.
te28f128j3d75

Specifications

Parameter Value Parameter Value
Rohs Code No Part Life Cycle Code Transferred
Ihs Manufacturer INTEL CORP Part Package Code TSOP
Package Description 14 X 20 MM, TSOP-56 Pin Count 56
Reach Compliance Code compliant ECCN Code EAR99
HTS Code 8542.32.00.51 Access Time-Max 75 ns
Alternate Memory Width 8 Command User Interface YES
Common Flash Interface YES Data Polling NO
JESD-30 Code R-PDSO-G56 JESD-609 Code e0
Length 18.4 mm Memory Density 134217728 bit
Memory IC Type FLASH Memory Width 16
Number of Functions 1 Number of Sectors/Size 128
Number of Terminals 56 Number of Words 8388608 words
Number of Words Code 8000000 Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min -40 °C
Organization 8MX16 Package Body Material PLASTIC/EPOXY
Package Code TSSOP Package Equivalence Code TSSOP56,.8,20
Package Shape RECTANGULAR Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size 4/8 words Parallel/Serial PARALLEL
Programming Voltage 2.7 V Qualification Status Not Qualified
Ready/Busy YES Seated Height-Max 1.2 mm
Sector Size 128K Standby Current-Max 0.00012 A
Supply Current-Max 0.08 mA Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES Technology CMOS
Temperature Grade INDUSTRIAL Terminal Finish TIN LEAD
Terminal Form GULL WING Terminal Pitch 0.5 mm
Terminal Position DUAL Toggle Bit NO
Type NOR TYPE

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the TE28F128J3D75 component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   AM29F128G08AFB2

Brands :  

Package :  

Description :  

Part Number :   AT49BV8192A

Brands :  

Package :  

Description :  

Part Number :   MX29GL128ELT2I-90G

Brands :  

Package :  

Description :  

Part Number :   S29GL128S90DHI010

Brands :  

Package :   FBGA-64

Description :   Flash Memory, Parallel NOR, 128 Mbit, 16M x 8bit, CFI, Parallel, FBGA, 64 Pins

Part Number :   W29GL128CTC90

Brands :  

Package :  

Description :  

Part points

  • The TE28F128J3D75 chip is a flash memory device manufactured by Intel. It has a capacity of 128 megabits and operates at a voltage of 2.7-3.6V. It uses a parallel interface and supports both asynchronous and synchronous read operations. The chip is commonly used in applications such as networking equipment, telecommunications devices, and consumer electronics for data storage and program storage purposes.
  • Features

    TE28F128J3D75 is a flash memory device manufactured by Intel. It offers a capacity of 128 megabit, with a supply voltage range of 2.7V to 3.6V. It operates at a high-speed frequency, allowing fast data transfer. The device is designed for use in automotive applications and has an extended temperature range of -40°C to +125°C.
  • Pinout

    The TE28F128J3D75 has a pin count of 64 and is a flash memory device. Its functions include storing data, providing non-volatile storage for electronic devices, and allowing for fast retrieval and writing of information.
  • Manufacturer

    Intel Corporation is the manufacturer of TE28F128J3D75. Intel is an American multinational corporation specializing in the design and production of semiconductors and other computer-related technology.
  • Application Field

    The TE28F128J3D75 is a flash memory device commonly used in the automotive industry for applications such as secure storage of firmware, data logging, and system initialization. It is designed to withstand harsh environments and has a high endurance to support frequent read/write operations.
  • Package

    The TE28F128J3D75 chip has a package type of FBGA, a form of TSOP, and a size of 28F128.

Datasheet PDF

Preliminary Specification TE28F128J3D75 PDF Download

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