Intel TE28F128J3D75
FLASH - NOR Memory IC 128Mbit Parallel 75 ns 56-TSOP
Brands: Intel Corp
Mfr.Part #: TE28F128J3D75
Datasheet: TE28F128J3D75 Datasheet (PDF)
Package/Case: TSOP-56
Product Type: Integrated Circuits (ICs)
RoHS Status:
Stock Condition: 2559 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomTE28F128J3D75 General Description
FLASH - NOR Memory IC 128Mbit Parallel 75 ns 56-TSOP
Features
- 128 Mb density
- Parallel interface
- 3.3V power supply
- Sector erase architecture
- Erase block size of 64 Kbytes
- Page size of 64 bytes
Application
- The TE28F128J3D75 flash memory can be used in a wide range of applications, including personal computers, mobile phones, digital cameras, and other consumer electronics devices.
- It is commonly used as a storage device for firmware, BIOS, and other code that needs to be stored in a non-volatile memory.
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Rohs Code | No | Part Life Cycle Code | Transferred |
Ihs Manufacturer | INTEL CORP | Part Package Code | TSOP |
Package Description | 14 X 20 MM, TSOP-56 | Pin Count | 56 |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code | 8542.32.00.51 | Access Time-Max | 75 ns |
Alternate Memory Width | 8 | Command User Interface | YES |
Common Flash Interface | YES | Data Polling | NO |
JESD-30 Code | R-PDSO-G56 | JESD-609 Code | e0 |
Length | 18.4 mm | Memory Density | 134217728 bit |
Memory IC Type | FLASH | Memory Width | 16 |
Number of Functions | 1 | Number of Sectors/Size | 128 |
Number of Terminals | 56 | Number of Words | 8388608 words |
Number of Words Code | 8000000 | Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Organization | 8MX16 | Package Body Material | PLASTIC/EPOXY |
Package Code | TSSOP | Package Equivalence Code | TSSOP56,.8,20 |
Package Shape | RECTANGULAR | Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Page Size | 4/8 words | Parallel/Serial | PARALLEL |
Programming Voltage | 2.7 V | Qualification Status | Not Qualified |
Ready/Busy | YES | Seated Height-Max | 1.2 mm |
Sector Size | 128K | Standby Current-Max | 0.00012 A |
Supply Current-Max | 0.08 mA | Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 2.7 V | Supply Voltage-Nom (Vsup) | 3 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Finish | TIN LEAD |
Terminal Form | GULL WING | Terminal Pitch | 0.5 mm |
Terminal Position | DUAL | Toggle Bit | NO |
Type | NOR TYPE |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the TE28F128J3D75 component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : AM29F128G08AFB2
Brands :
Package :
Description :
Part Number : AT49BV8192A
Brands :
Package :
Description :
Part Number : MX29GL128ELT2I-90G
Brands :
Package :
Description :
Part Number : S29GL128S90DHI010
Brands :
Package : FBGA-64
Description : Flash Memory, Parallel NOR, 128 Mbit, 16M x 8bit, CFI, Parallel, FBGA, 64 Pins
Part Number : W29GL128CTC90
Brands :
Package :
Description :
Part points
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The TE28F128J3D75 chip is a flash memory device manufactured by Intel. It has a capacity of 128 megabits and operates at a voltage of 2.7-3.6V. It uses a parallel interface and supports both asynchronous and synchronous read operations. The chip is commonly used in applications such as networking equipment, telecommunications devices, and consumer electronics for data storage and program storage purposes.
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Features
TE28F128J3D75 is a flash memory device manufactured by Intel. It offers a capacity of 128 megabit, with a supply voltage range of 2.7V to 3.6V. It operates at a high-speed frequency, allowing fast data transfer. The device is designed for use in automotive applications and has an extended temperature range of -40°C to +125°C. -
Pinout
The TE28F128J3D75 has a pin count of 64 and is a flash memory device. Its functions include storing data, providing non-volatile storage for electronic devices, and allowing for fast retrieval and writing of information. -
Manufacturer
Intel Corporation is the manufacturer of TE28F128J3D75. Intel is an American multinational corporation specializing in the design and production of semiconductors and other computer-related technology. -
Application Field
The TE28F128J3D75 is a flash memory device commonly used in the automotive industry for applications such as secure storage of firmware, data logging, and system initialization. It is designed to withstand harsh environments and has a high endurance to support frequent read/write operations. -
Package
The TE28F128J3D75 chip has a package type of FBGA, a form of TSOP, and a size of 28F128.
Datasheet PDF
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