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Intel FWE6300ESB

Name: FWE6300ESB
Rating: 4.5 (6 reviews)

I/O Controller Hub 689-Pin UBGA

Brands: Intel Corp

Mfr.Part #: FWE6300ESB

Datasheet: FWE6300ESB Datasheet (PDF)

Package/Case: BGA

Product Type: Integrated Circuits (ICs)

RoHS Status:

Stock Condition: 2914 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for FWE6300ESB or email to us: Email: [email protected], we will contact you within 12 hours.

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Remark

Ovaga has a large stock of FWE6300ESB Integrated Circuits (ICs) from Intel Corp and we guarantee that they are original,brand new parts sourced directly from Intel Corp We can provide quality testing reports for FWE6300ESB upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.

Specifications

Parameter	Value	Parameter	Value
place	Indonesia	launch_date	Jan 11, 2007
last_inspection_date	+90	rohs_version	2011/65/EU, 2015/863
supplier_cage_code	4BA62	htsusa	8542310001
schedule_b	8542310000	ppap	False
aec	False	RadHard
Dose Level	N/A

Shipping

	Ship Fee	Lead Time
DHL	$20.00-$40.00 (0.50 KG)	2-5 days
Fedex	$20.00-$40.00 (0.50 KG)	2-5 days
UPS	$20.00-$40.00 (0.50 KG)	2-5 days
TNT	$20.00-$40.00 (0.50 KG)	2-5 days
EMS	$20.00-$40.00 (0.50 KG)	2-5 days
REGISTERED AIR MAIL	$20.00-$40.00 (0.50 KG)	2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment		Hand Fee
	Wire Transfer	charge US$30.00 banking fee.
	Paypal	charge 4.0% service fee.
	Credit Card	charge 3.5% service fee.
	Western Union	charge US.00 banking fee.
	Money Gram	charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

Step1 :Product
Step2 :Vacuum packaging
Step3 :Anti-static bag
Step4 :Individual packaging
Step5 :Packaging boxes
Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Part points

The FWE6300ESB chip is a advanced microcontroller chip designed for embedded systems applications. It features a high-performance ARM Cortex-M3 core, versatile peripheral interfaces, and low power consumption. It is suitable for a wide range of industrial and consumer electronics applications.
Equivalent

The FWE6300ESB chip is equivalent to the PIC16F630 and PIC16F636 microcontrollers from Microchip Technology Inc. Both chips are low-power 8-bit CMOS microcontrollers with comparable features and specifications. These chips can be used interchangeably in various applications.
Features

1. Power source: Electric 2. 5 cooking elements, including a triple-ring burner and a warming zone 3. True convection baking for even cooking results 4. Self-cleaning function for easy maintenance 5. Stainless steel finish for a sleek look 6. Digital display with touch controls 7. Oven capacity of 5.9 cubic feet.
Pinout

The FWE6300ESB has a 48-pin count and is a System-on-Chip (SoC) module designed for embedded systems. It features a powerful dual-core ARM Cortex-A9 processor, a variety of communication interfaces, and advanced security features for IoT applications.
Manufacturer

The FWE6300ESB is manufactured by Frigidaire, which is a multinational brand known for producing home appliances such as refrigerators, stoves, washing machines, and dishwashers. The company has a reputation for high-quality and reliable products in the kitchen and home appliance industry.
Application Field

The FWE6300ESB is commonly used in commercial and institutional settings such as hospitals, schools, and catering facilities. It is ideal for holding and transporting hot food items for extended periods of time, ensuring food safety and quality while also providing convenient serving options for customers and guests.
Package

The FWE6300ESB chip is available in a BGA (Ball Grid Array) package type with a form factor of 29 mm x 29 mm. The size of the chip itself is 21 mm x 21 mm with a thickness of 1.2 mm.