Intel RC28F256P30B85
FLASH - NOR Memory IC 256Mbit Parallel 52 MHz 85 ns 64-EasyBGA (10x13)
Brands: INTEL CORP
Mfr.Part #: RC28F256P30B85
Datasheet: RC28F256P30B85 Datasheet (PDF)
Package/Case: BGA-64
Product Type: Flash Memories
RoHS Status:
Stock Condition: 6554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomRC28F256P30B85 General Description
FLASH - NOR Memory IC 256Mbit Parallel 52 MHz 85 ns 64-EasyBGA (10x13)
Features
- High performance
- — 85/88 ns initial access
- — 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
- — 25 ns asynchronous-page read mode
- — 4-, 8-, 16-, and continuous-word burst mode
- — Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
- — 1.8 V buffered programming at 7 µs/byte (Typ)
- Architecture
- — Multi-Level Cell Technology: Highest Density at Lowest Cost
- — Asymmetrically-blocked architecture
- — Four 32-KByte parameter blocks: top or bottom configuration
- — 128-KByte main blocks
- Voltage and Power
- —VCC(core) voltage: 1.7 V – 2.0 V
- —VCCQ (I/O) voltage: 1.7 V – 3.6 V
- — Standby current: 55 µA (Typ) for 256-Mbit
- — 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
- Quality and Reliability
- — Operating temperature: –40 °C to +85 °C
- 1-Gbit in SCSP is –30 °C to +85 °C
- — Minimum 100,000 erase cycles per block
- — ETOX™ VIII process technology (130 nm)
- Security
- — One-Time Programmable Registers:
- 64 unique factory device identifier bits
- 64 user-programmable OTP bits
- Additional 2048 user-programmable OTP bits
- — Selectable OTP Space in Main Array:
- 4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
- — Absolute write protection: VPP= VSS
- — Power-transition erase/program lockout
- — Individual zero-latency block locking
- — Individual block lock-down
- Software
- — 20 µs (Typ) program suspend
- — 20 µs (Typ) erase suspend
- —Intel® Flash Data Integrator optimized
- — Basic Command Set and Extended Command Set compatible
- — Common Flash Interface capable
- Density and Packaging
- — 64/128/256-Mbit densities in 56-Lead TSOP package
- — 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
- — 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
- — 16-bit wide data bus
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Rohs Code | No | Part Life Cycle Code | Transferred |
Ihs Manufacturer | INTEL CORP | Part Package Code | BGA |
Package Description | BGA-64 | Pin Count | 64 |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code | 8542.32.00.51 | Access Time-Max | 88 ns |
Additional Feature | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | Boot Block | BOTTOM |
Command User Interface | YES | Common Flash Interface | YES |
Data Polling | NO | JESD-30 Code | R-PBGA-B64 |
JESD-609 Code | e0 | Length | 13 mm |
Memory Density | 268435456 bit | Memory IC Type | FLASH |
Memory Width | 16 | Number of Functions | 1 |
Number of Sectors/Size | 4,255 | Number of Terminals | 64 |
Number of Words | 16777216 words | Number of Words Code | 16000000 |
Operating Mode | ASYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 16MX16 |
Package Body Material | PLASTIC/EPOXY | Package Code | TBGA |
Package Equivalence Code | BGA64,8X8,40 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE | Page Size | 4 words |
Parallel/Serial | PARALLEL | Power Supplies | 1.8,1.8/3.3 V |
Programming Voltage | 1.8 V | Qualification Status | Not Qualified |
Seated Height-Max | 1.2 mm | Sector Size | 16K,64K |
Standby Current-Max | 0.000005 A | Supply Current-Max | 0.051 mA |
Supply Voltage-Max (Vsup) | 2 V | Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN LEAD | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Toggle Bit | NO | Type | NOR TYPE |
Width | 10 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products