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Renesas R7S721011VCBG#AC0

Microprocessors - MPU RZ/A1M 400MHz 5MB BGA324 Q2A no enc MP

ISO14001 ISO9001 DUNS

Brands: Renesas Technology Corp

Mfr.Part #: R7S721011VCBG#AC0

Datasheet: R7S721011VCBG#AC0 Datasheet (PDF)

Package/Case: 324-BGA

RoHS Status:

Stock Condition: 2244 pcs, New Original

Product Type: Embedded Processors & Controllers

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $26.439 $26.439
200 $10.232 $2046.400
500 $9.872 $4936.000
1000 $9.696 $9696.000

In Stock:2244 PCS

- +

Quick Quote

Please submit RFQ for R7S721011VCBG#AC0 or email to us: Email: [email protected], we will contact you within 12 hours.

R7S721011VCBG#AC0 General Description

The RZ/A1M Group MPUs are full-featured with an Arm® Cortex®-A9 core running at 400MHz and 5MB of on-chip SRAM. With 5MB on-chip SRAM, the RZ/A1M supports up to 2 Displays with WSVGA (1024x600) resolution or a single display with WXGA (1280x800) resolution without the need for external memory. RZ/A1M enables very compact embedded designs without the need to worry about memory procurement and memory EOL. With RZ/A1M, you can design your embedded system like an MCU and get the performance of a 400MHz Arm® Cortex®-A9 MPU. Enabled for support with Linux, RTOS or Bare-metal, this is the ideal device for designing Intelligent IoT End Point devices with compactness and high performance. Supported in QFP and BGA packages with different sizes to support board layout flexibility and with SDRAM interface to expand up to 128MB of external memory. Get Started Using RZ/A1 MPUs.

r7s721011vcbg-ac0

Features

  • CPU: Cortex-A9 core, Max. 400MHz
  • Voltage: 3V to 3.6V
  • Package: 324-pin FBGA, 256-pin LFBGA, 256-pin LFQFP
  • Memory: SRAM Max. 5MB
  • Timer: 32-bit Timer (ch) x 2, 16-bit Timer (ch) x 5, Watchdog Timer (ch) x 1, Motor Control PWM Timer x 8
  • PWM: PWM Output x 16, 3-phase PWM Output Function
  • Analog function: 12-bit A/D Converter (ch) x 8
  • Others: PLL, RTC, Power-On Reset

Specifications

Parameter Value Parameter Value
Pin Count 324 Package Category BGA
Released Date Jun 25, 2019 Last Modified Date Aug 1, 2023 2:08 PM UTC
Series RZ/A1M Package Tray
Product Status Active Core Processor ARM® Cortex®-A9
Number of Cores/Bus Width 1 Core, 32-Bit Speed 400MHz
Co-Processors/DSP Multimedia; NEON™ MPE RAM Controllers SDRAM, SRAM
Graphics Acceleration Yes Display & Interface Controllers DVD, VDC
Ethernet 10/100Mbps (1), 100Mbps (1) USB USB 2.0 (2)
Voltage - I/O 1.2V, 3.3V Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount Package / Case 324-FBGA
Supplier Device Package 324-FBGA (19x19) Additional Interfaces CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
Base Product Number R7S721011

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The R7S721011VCBG#AC0 chip is an integrated circuit designed by Renesas Electronics. It is part of the RZ/A1H series and offers high-performance processing capabilities for embedded systems. The chip features a dual-core Cortex-A9 processor, on-chip memory, various peripherals, and graphics acceleration. It is commonly used in applications such as industrial automation, home appliances, and automotive systems.
  • Equivalent

    Some equivalent products of the R7S721011VCBG#AC0 chip are R7S721011VCFP#AC0, R7S721011VCFP#AC1, and R7S721011VCFP#BP0.
  • Features

    The R7S721011VCBG#AC0 is a microcontroller unit (MCU) developed by Renesas. Some of its features include a ARM Cortex-M3 core, 512KB flash memory, 64KB RAM, 8KB data flash memory, and various communication interfaces such as UART, SPI, I2C, CAN, and USB.
  • Pinout

    The R7S721011VCBG#AC0 is a microcontroller with 121-pin count. It is commonly used in various electronic devices for controlling and managing functions such as data processing, memory access, and communication interfaces.
  • Manufacturer

    The manufacturer of the R7S721011VCBG#AC0 is Renesas Electronics Corporation. Renesas Electronics is a Japanese multinational semiconductor manufacturer. It specializes in a wide range of products including microcontrollers, mixed-signal integrated circuits, and system-on-chip solutions for automotive, industrial, and consumer electronics applications.
  • Application Field

    The R7S721011VCBG#AC0 is a microcontroller unit (MCU) that can be used in various applications such as home appliances, industrial automation, and automotive systems. It offers high performance, low power consumption, and high integration, making it suitable for a wide range of embedded system applications.
  • Package

    The R7S721011VCBG#AC0 chip package type is BGA (Ball Grid Array), its form is rectangular, and the size is specified as 10mm x 10mm.

Datasheet PDF

Preliminary Specification R7S721011VCBG#AC0 PDF Download

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  • quantity

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  • guarantee

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