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Renesas R7FA6M3AH3CFC#AA0
ARM Microcontrollers - MCU MCU RA6 ARM CM4 120MHz 2M/640K QFP176
Brands: Renesas Technology Corp
Mfr.Part #: R7FA6M3AH3CFC#AA0
Datasheet: R7FA6M3AH3CFC#AA0 Datasheet (PDF)
Package/Case: QFP-176
RoHS Status:
Stock Condition: 3487 pcs, New Original
Product Type: Embedded Processors & Controllers
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $11.541 | $11.541 |
| 10 | $10.125 | $101.250 |
| 30 | $9.260 | $277.800 |
| 100 | $8.537 | $853.700 |
In Stock:3487 PCS
R7FA6M3AH3CFC#AA0 General Description
The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M3 is suitable for IoT applications requiring TFT, Ethernet, security, large embedded RAM, and USB High Speed (HS).
Features
- 120MHz Arm® Cortex®-M4
- 1MB - 2MB Flash memory and 640kB SRAM
- 64kB Data Flash to store data as in EEPROM
- Scalable from 100-pin to 176-pin packages
- Ethernet controller with DMA
- TFT controller/2D accelerator/JPEG decoder
- Capacitive touch sensing unit
- USB 2.0 Full Speed/USB High Speed
- CAN 2.0B
- SCI (UART, Simple SPI, Simple I2C)
- SPI/I2C multimaster interface/SDHI
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 176 | Package Category | Quad Flat Packages |
| Released Date | Dec 5, 2020 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The R7FA6M3AH3CFC#AA0 chip is a microcontroller manufactured by Renesas Electronics. It is based on Renesas' RXv3 core technology and offers advanced security and performance capabilities. It is designed for a wide range of applications, including industrial automation, IoT devices, and consumer electronics.
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Pinout
The R7FA6M3AH3CFC#AA0 is a microcontroller with 128 pins. It functions as a general-purpose microcontroller with a wide range of applications, offering various features and capabilities for efficient control and processing. -
Application Field
The R7FA6M3AH3CFC#AA0 is a microcontroller that can be used in various application areas, such as industrial automation, consumer electronics, Internet of Things (IoT), and automotive systems. It offers high-performance computing capabilities, extensive connectivity options, and advanced security features, making it suitable for a wide range of embedded applications. -
Package
The R7FA6M3AH3CFC#AA0 chip has a package type of BGA (Ball Grid Array), a form of 3D (three-dimensional), and a size of 10mm x 10mm.
Datasheet PDF
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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