ON FSUSB30MUX
Low-Power 2-Port High-Speed USB 2.0 (480 Mbps) Switch
Brands: Onsemi
Mfr.Part #: FSUSB30MUX
Datasheet: FSUSB30MUX Datasheet (PDF)
Package/Case: MSOP-10
RoHS Status:
Stock Condition: 9458 pcs, New Original
Product Type: USB Switch ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $0.619 | $0.619 |
10 | $0.507 | $5.070 |
30 | $0.452 | $13.560 |
100 | $0.395 | $39.500 |
500 | $0.361 | $180.500 |
1000 | $0.345 | $345.000 |
In Stock:9458 PCS
FSUSB30MUX General Description
The FSUSB30 is a low-power, two-port, high-speed USB 2.0 switch. Configured as a double-pole double-throw (DPDT) switch, it is optimized for switching between two high-speed (480Mbps) sources or a Hi-Speed and Full-Speed (12Mbps) source. The FSUSB30 is compatible with the requirements of USB2.0 and features an extremely low on capacitance (CON) of 3.7pF. The wide bandwidth of this device (720MHz), exceeds the bandwidth needed to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior channel-to-channel crosstalk minimizes interference.
The FSUSB30 contains special circuitry on the D+/D- pins which allows the device to withstand an overvoltage condition when powered off. This device is also designed to minimize current consumption even when the control voltage applied to the S pin, is lower than the supply voltage (VCC). This feature is especially valuable to ultra-portable applications such as cell phones, allowing for direct interface with the general purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, PDAs, digital cameras, printers, and notebook computers.
Features
- Low On Capacitance: 3.7 pF (Typical)
- Low On Resistance: 6.5 Ω (Typical)
- Low Power Consumption: 1 µA (Maximum)
- 10 µA Maximum ICCT over and Expanded Control Voltage Range (VIN=2.6 V, VCC=4.3 V)
- Wide -3 dB bandwidth, >720 MHz
- 8 kV ESD Protection
- Power-Off Protection when VCC = 0 V, D+/D- pins can Tolerate up to 5.5 V
Application
- Media Tablets
- Storage & Peripherals
- Mobile Handsets
- Wireless LAN Card & Broadband Access
- PMP/MP3 Players
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Status | Last Shipments | Compliance | PbAHP |
Package Type | MSOP-10 | Case Outline | 846AP |
MSL Type | 1 | MSL Temp (°C) | 260 |
Container Type | REEL | Container Qty. | 4000 |
ON Target | N | Channels | 2 |
Number of Switches | 2 | Configuration | DPDT |
Icc Max (µA) | 1 | ron Max (Ω) | 10 |
VCC Min (V) | 3 | VCC Max (V) | 4.3 |
Pricing ($/Unit) | Price N/A |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The FSUSB30MUX chip is an integrated IC that functions as a USB 3.0 switching and muxing solution. It enables the sharing of USB 3.0 data and power between different devices, allowing for efficient and flexible USB connectivity. The chip provides high-speed data transmission and is commonly used in electronic devices that require USB multiplexing capability.
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Equivalent
Some equivalent products to the FSUSB30MUX chip include the TI TUSB2074, the NXP PTN36241B, and the Diodes PI3USB102-AZHEX. These chips offer similar functionality as the FSUSB30MUX, providing USB multiplexing and demultiplexing capabilities. -
Features
The FSUSB30MUX is a 3:1 USB 3.0 multiplexer/demultiplexer switch. It provides high-speed data transmission and seamless switching between three USB 3.0 ports. It supports data rates of up to 5 Gbps and features low ON resistance, low power consumption, and compatibility with USB 2.0 and 1.1 devices. -
Pinout
The FSUSB30MUX is a multiplexer switch IC. It has 6 pins: VBUS, SDA, SCL, USB_SEL1, USB_SEL2, and GND. The VBUS pin is used to detect the presence of USB power, SDA and SCL are I2C communication pins, USB_SEL1 and USB_SEL2 control the output, and GND is the ground connection. -
Manufacturer
The manufacturer of the FSUSB30MUX is Texas Instruments (TI). Texas Instruments is a semiconductor manufacturing company and one of the largest suppliers of integrated circuits globally. They produce a wide range of analog and digital semiconductor products, including microcontrollers, amplifiers, and power management devices, among others. -
Application Field
The FSUSB30MUX is typically used in mobile devices and tablets, as well as in docking stations and laptops. It can be applied for USB Type-C™ port switching, USB power delivery (PD) multiplexing, and SuperSpeed data muxing. -
Package
The FSUSB30MUX chip comes in a small package type called WLCSP (Wafer Level Chip Scale Package), which has no leads and is mounted directly on the circuit board. It has a form factor of 0.66mm x 0.94mm and a thickness of 0.4mm.
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