PC28F512P33BFD
NOR Flash Parallel/Serial 2.5V/3.3V 512M-bit 32M x 16 95ns 64-Pin BGA Tray
Brands: Alliance Memory
Mfr.Part #: PC28F512P33BFD
Datasheet: PC28F512P33BFD Datasheet (PDF)
Package/Case: BGA-64
Product Type: NOR Flash
PC28F512P33BFD General Description
FLASH - NOR Memory IC 512Mbit Parallel 52 MHz 95 ns 64-LBGA (11x13)
Features
- High-Performance Read, Program and Erase
- – 96 ns initial read access
- – 108 MHz with zero wait-state synchronous burst reads: 7 ns clock-to-data output
- – 133 MHz with zero wait-state synchronous burst reads: 5.5 ns clock-to-data output
- – 8-, 16-, and continuous-word synchronous-burst Reads
- – Programmable WAIT configuration
- – Customer-configurable output driver impedance
- – Buffered Programming: 2.0 μs/Word (typ), 512-Mbit 65 nm
- – Block Erase: 0.9 s per block (typ)
- – 20 μs (typ) program/erase suspend
- Architecture
- – 16-bit wide data bus
- – Multi-Level Cell Technology
- – Symmetrically-Blocked Array Architecture
- – 256-Kbyte Erase Blocks
- – 1-Gbit device: Eight 128-Mbit partitions
- – 512-Mbit device: Eight 64-Mbit partitions
- – 256-Mbit device: Eight 32-Mbit partitions
- – 128-Mbit device: Eight 16-Mbit partitions
- – Read-While-Program and Read-While-Erase
- – Status Register for partition/device status
- – Blank Check feature
- Quality and Reliability
- – Expanded temperature: –30 °C to +85 °C
- – Minimum 100,000 erase cycles per block
- – 65nm Process Technology
- Power
- – Core voltage: 1.7 V - 2.0 V
- – I/O voltage: 1.7 V - 2.0 V
- – Standby current: 60 μA (typ) for 512-Mbit, 65 nm
- – Deep Power-Down mode: 2 μA (typ)
- – Automatic Power Savings mode
- – 16-word synchronous-burst read current: 23 mA (typ) @ 108 MHz; 24 mA (typ) @ 133 MHz
- Software
- – Micron® Flash data integrator (FDI) optimized
- – Basic command set (BCS) and extended command set (ECS) compatible
- – Common Flash interface (CFI) capable
- Security
- – One-time programmable (OTP) space
- 64 unique factory device identifier bits
- 2112 user-programmable OTP bits
- – Absolute write protection: VPP = GND
- – Power-transition erase/program lockout
- – Individual zero latency block locking
- – Individual block lock-down
- Density and packaging
- – 128Mb, 256Mb, 512Mbit, and 1-Gbit
- – Address-data multiplexed and non-multiplexed interfaces
- – 64-Ball Easy BGA
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer | Alliance Memory | Product Category | NOR Flash |
Mounting Style | SMD/SMT | Package / Case | BGA-64 |
Memory Size | 512 Mbit | Supply Voltage - Min | 2.3 V |
Supply Voltage - Max | 3.6 V | Active Read Current - Max | 31 mA |
Interface Type | Parallel | Maximum Clock Frequency | 52 MHz |
Organization | 32 M x 16 | Data Bus Width | 16 bit |
Timing Type | Asynchronous, Synchronous | Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 85 C | Brand | Alliance Memory |
Moisture Sensitive | Yes | Product Type | NOR Flash |
Speed | 95 ns | Factory Pack Quantity | 300 |
Subcategory | Memory & Data Storage |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The PC28F512P33BFD is a Flash memory chip manufactured by Intel. It has a capacity of 512 megabits and operates at a voltage range of 2.7V to 3.6V. This chip is commonly used in various electronic devices for storing data and program code.
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Equivalent
Some equivalent products to the PC28F512P33BFD chip include the SST39VF512 and the MX29LV800CB. These chips are all 512Mb flash memory chips with similar specifications and features. -
Features
PC28F512P33BFD is a 512Mb NAND Flash memory device with 3.3V voltage operation. It offers high-speed synchronous read and program operations, advanced security features, and a high-quality single-level cell (SLC) NAND technology for reliable data storage. It is available in a 63-ball BGA package. -
Pinout
The PC28F512P33BFD is a 48-pin flash memory device. It functions as a non-volatile storage solution for storing data, programs, and firmware in various electronic devices. It features a 512 Mbit capacity and operates at a standard voltage range of 2.7-3.6V. -
Manufacturer
The PC28F512P33BFD is manufactured by Intel Corporation, which is an American multinational corporation and technology company known for producing a wide range of semiconductor chip products. Intel is one of the largest and most influential companies in the semiconductor industry, particularly in the field of computer processing technology. -
Application Field
The PC28F512P33BFD is commonly used in applications such as industrial control systems, automotive infotainment, smart meters, and medical devices. It is ideal for applications requiring high performance, reliability, and security, making it suitable for a wide range of embedded systems. -
Package
The PC28F512P33BFD chip comes in a surface mount package type called FBGA (Fine-pitch Ball Grid Array). It has a form factor of 16M x 16 and a size of 48-ball, 6x8mm.
Key points
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The PC28F512P33BFD is a Flash memory chip manufactured by Intel. It has a capacity of 512 megabits and operates at a voltage range of 2.7V to 3.6V. This chip is commonly used in various electronic devices for storing data and program code.
-
Equivalent
Some equivalent products to the PC28F512P33BFD chip include the SST39VF512 and the MX29LV800CB. These chips are all 512Mb flash memory chips with similar specifications and features. -
Features
PC28F512P33BFD is a 512Mb NAND Flash memory device with 3.3V voltage operation. It offers high-speed synchronous read and program operations, advanced security features, and a high-quality single-level cell (SLC) NAND technology for reliable data storage. It is available in a 63-ball BGA package. -
Pinout
The PC28F512P33BFD is a 48-pin flash memory device. It functions as a non-volatile storage solution for storing data, programs, and firmware in various electronic devices. It features a 512 Mbit capacity and operates at a standard voltage range of 2.7-3.6V. -
Manufacturer
The PC28F512P33BFD is manufactured by Intel Corporation, which is an American multinational corporation and technology company known for producing a wide range of semiconductor chip products. Intel is one of the largest and most influential companies in the semiconductor industry, particularly in the field of computer processing technology. -
Application Field
The PC28F512P33BFD is commonly used in applications such as industrial control systems, automotive infotainment, smart meters, and medical devices. It is ideal for applications requiring high performance, reliability, and security, making it suitable for a wide range of embedded systems. -
Package
The PC28F512P33BFD chip comes in a surface mount package type called FBGA (Fine-pitch Ball Grid Array). It has a form factor of 16M x 16 and a size of 48-ball, 6x8mm.
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