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PC28F256P33BFE
FLASH - NOR (MLC) Memory IC 256Mbit CFI 52 MHz 95 ns 64-LBGA (11x13)
Brands: Alliance Memory, Inc.
Mfr.Part #: PC28F256P33BFE
Datasheet: PC28F256P33BFE Datasheet (PDF)
Package/Case: 64-LBGA
RoHS Status:
Stock Condition: 7,271 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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1
*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $17.403 | $17.403 |
| 300 | $6.946 | $2083.800 |
| 600 | $6.713 | $4027.800 |
| 900 | $6.598 | $5938.200 |
In Stock: 7,271 PCS
PC28F256P33BFE General Description
FLASH - NOR (MLC) Memory IC 256Mbit CFI 52 MHz 95 ns 64-LBGA (11x13)
Features
- High performance
- — 85/88 ns initial access
- — 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
- — 25 ns asynchronous-page read mode
- — 4-, 8-, 16-, and continuous-word burst mode
- — Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
- — 1.8 V buffered programming at 7 µs/byte (Typ)
- Architecture
- — Multi-Level Cell Technology: Highest Density at Lowest Cost
- — Asymmetrically-blocked architecture
- — Four 32-KByte parameter blocks: top or bottom configuration
- — 128-KByte main blocks
- Voltage and Power
- —VCC(core) voltage: 1.7 V – 2.0 V
- —VCCQ (I/O) voltage: 1.7 V – 3.6 V
- — Standby current: 55 µA (Typ) for 256-Mbit
- — 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
- Quality and Reliability
- — Operating temperature: –40 °C to +85 °C
- 1-Gbit in SCSP is –30 °C to +85 °C
- — Minimum 100,000 erase cycles per block
- — ETOX™ VIII process technology (130 nm)
- Security
- — One-Time Programmable Registers:
- 64 unique factory device identifier bits
- 64 user-programmable OTP bits
- Additional 2048 user-programmable OTP bits
- — Selectable OTP Space in Main Array:
- 4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
- — Absolute write protection: VPP= VSS
- — Power-transition erase/program lockout
- — Individual zero-latency block locking
- — Individual block lock-down
- Software
- — 20 µs (Typ) program suspend
- — 20 µs (Typ) erase suspend
- —Intel® Flash Data Integrator optimized
- — Basic Command Set and Extended Command Set compatible
- — Common Flash Interface capable
- Density and Packaging
- — 64/128/256-Mbit densities in 56-Lead TSOP package
- — 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
- — 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
- — 16-bit wide data bus
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Series | Axcell™ | Package | Tray |
| Product Status | Obsolete | Programmabe | Not Verified |
| Memory Type | Non-Volatile | Memory Format | FLASH |
| Technology | FLASH - NOR (MLC) | Memory Size | 256Mbit |
| Memory Organization | 16M x 16 | Memory Interface | CFI |
| Clock Frequency | 52 MHz | Write Cycle Time - Word, Page | 95ns |
| Access Time | 95 ns | Voltage - Supply | 2.3V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) | Mounting Type | Surface Mount |
| Package / Case | 64-LBGA |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The PC28F256P33BFE is a flash memory chip manufactured by Intel. It has a capacity of 256 megabits and operates on a 3.0 to 3.6V power supply. The chip utilizes the Parallel NOR architecture and has a random access time of 70 nanoseconds. It is commonly used in various electronic devices for data storage and retrieval.
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Equivalent
Some equivalent products to the PC28F256P33BFE chip include the AT29C256-12PC, M29F200BB70M3T, and the AM29LV256ML-100SC. These chips have similar specifications and functions, making them suitable replacements for the PC28F256P33BFE. -
Features
The PC28F256P33BFE is a specific type of flash memory chip. Its features include a capacity of 256 megabits (32 megabytes), a 3-volt power supply, a single-wide Flash Small-Block Erase architecture, and 33 nanometer process technology. It is commonly used in storage applications for various electronic devices. -
Pinout
The PC28F256P33BFE is a 28-pin flash memory chip. It is typically used for storing data in electronic devices. The specific functions of each pin can vary depending on the device and its configuration. -
Manufacturer
Intel is the manufacturer of the PC28F256P33BFE. Intel is a multinational technology company that specializes in the design and manufacturing of computer processors, memory chips, and other related hardware. -
Application Field
The PC28F256P33BFE is a flash memory module with a capacity of 256MB. It can be used in various application areas, such as automotive systems, industrial automation, networking and telecommunications equipment, consumer electronics, and embedded systems, where reliable and non-volatile storage of data is required. -
Package
The PC28F256P33BFE chip is available in a BGA package type (Ball Grid Array). It has a form factor of 33mm x 22mm, and its size is 581mm².
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