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NXP MC9S12DJ256CPVE 48HRS

S12dj 16-Bit Mcu, Hcs12 Core, 256Kb Flash, Qfp 112 Rohs Compliant: Yes

ISO14001 ISO9001 DUNS

Brands: NXP Semiconductor

Mfr.Part #: MC9S12DJ256CPVE

Datasheet: MC9S12DJ256CPVE Datasheet (PDF)

Package/Case: TQFP-112

RoHS Status:

Stock Condition: 2,717 pcs, New Original

Product Type: Microcontrollers

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $58.653 $58.653
300 $22.699 $6809.700
600 $21.900 $13140.000
900 $21.507 $19356.300

In Stock: 2,717 PCS

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Quick Quote

Please submit RFQ for MC9S12DJ256CPVE or email to us: Email: [email protected], we will contact you within 12 hours.

MC9S12DJ256CPVE General Description

MCU, 16BIT, 256K FLASH, 25MHZ, 112LQFP; Controller Family/Series:HCS12/S12X; Core Size:16bit; No. of I/O's:91; Program Memory Size:256 KB; EEPROM Memory Size:4KB; RAM Memory Size:12KB; CPU Speed:25MHz; Oscillator Type:External; No. of Timers:8; Peripherals:ADC, PWM, Timer; No. of PWM Channels:8; Digital IC Case Style:LQFP; Supply Voltage Range:2.35V to 2.75V, 4.5V to 5.25V; Operating Temperature Range:-40°C to +85°C; No. of Pins:112; SVHC:No SVHC (20-Jun-2011); Clock Frequency:25MHz; Flash Memory Size:256KB; Interface:CAN, I2C, SCI, SPI; Interface:CAN, I2C, SCI, SPI; Interface Type:SCI, SPI, I2C, CAN, J1850; Memory Type:FLASH; No. of ADC Inputs:16; No. of Bits:16; No. of I/O's:91; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Package / Case:LQFP; Program Memory Size:256KB; Supply Voltage Max:5.25V; Supply Voltage Min:4.5V; Termination Type:SMD

mc9s12dj256cpve

Features

  • 256 KB flash memory
  • 8 KB RAM
  • 16 MHz bus frequency
  • 112 GPIO pins
  • 16-channel 10-bit ADC
  • 6-channel PWM (Pulse Width Modulation)
  • 4-channel CAN (Controller Area Network) module
  • SCI (Serial Communications Interface) and SPI (Serial Peripheral Interface) modules
  • Interrupt controller

Application

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  • MC9S12DP256CAG by NXP Semiconductors
  • MC9S12DT256CAG by NXP Semiconductors
  • S912XEQ512J2MAL by NXP Semiconductors

Specifications

Parameter Value Parameter Value
Case/Package LQFP Mount Surface Mount
Number of Pins 112 Weight 1.278308 g
Access Time 25 µs Core Architecture HCS12
Data Bus Width 16 b Density 2 Mb
Frequency 25 MHz Interface CAN, I2C, SCI, SPI
Max Frequency 25 MHz Max Operating Temperature 85 °C
Max Supply Voltage 2.75 V Memory Size 256 kB
Memory Type EEPROM, FLASH Min Operating Temperature -40 °C
Min Supply Voltage 2.35 V Number of Bits 16
Number of I/Os 91 Number of Programmable I/O 91
Number of PWM Channels 8 Number of Timers/Counters 8
Oscillator Type Internal Peripherals I2C, PWM, WDT
RAM Size 12 kB Schedule B 8542310000
Termination SMD/SMT

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The MC9S12DJ256CPVE chip is a microcontroller unit (MCU) manufactured by NXP Semiconductors. It belongs to the HCS12 family and offers 256KB of flash memory, 16KB of RAM, and various interface options. It is designed for automotive applications, offering high-performance computing power and enhanced peripheral capabilities.
  • Equivalent

    Some equivalent products of the MC9S12DJ256CPVE chip include the MC9S12DG256CPVE, MC9S12DJ256CPVE, and MC9S12DG256CPVE.
  • Features

    The MC9S12DJ256CPVE is a microcontroller featuring 256KB flash memory, 16KB RAM, 8-channel 10-bit ADC, operating frequency of up to 25MHz, 112 general-purpose I/O pins, and a variety of communication interfaces including SPI, I2C, CAN, and SCI. It is designed for a wide range of applications, including automotive, industrial, and consumer electronics.
  • Pinout

    The MC9S12DJ256CPVE is a microcontroller with a pin count of 112. It offers various functions, including a 16-bit central processing unit (CPU), integrated peripherals, and memory options.
  • Manufacturer

    The MC9S12DJ256CPVE is manufactured by NXP Semiconductors. NXP is a leading semiconductor company providing high-performance mixed-signal products. They specialize in secure connectivity solutions for embedded applications in various industries, including automotive, industrial, and Internet of Things (IoT).
  • Application Field

    The MC9S12DJ256CPVE microcontroller can be used in various application areas, including industrial control systems, automotive electronics, consumer electronics, and medical devices. Its high processing power, integrated peripherals, and extensive memory make it suitable for demanding and complex applications.
  • Package

    The package type of the MC9S12DJ256CPVE chip is a 112-LQFP (Low Profile Quad Flat Pack). It has a quad flat package form and the size of the chip is 20mm x 20mm (0.8 inches x 0.8 inches).

Datasheet PDF

Preliminary Specification MC9S12DJ256CPVE PDF Download

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