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High-performance -bit hybrid controller for complex signal processing application

ISO14001 ISO9001 DUNS

Brands: NXP Semiconductor

Mfr.Part #: MC56F8123VFBE

Datasheet: MC56F8123VFBE Datasheet (PDF)

Package/Case: LQFP-64

Product Type: Microcontrollers

RoHS Status:

Stock Condition: 3,726 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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MC56F8123VFBE General Description

56800E 56F8xxx Microcontroller IC 16-Bit 40MHz 32KB (16K x 16) FLASH 64-LQFP (10x10)



  • 32-bit DSP core with Harvard architecture
  • Single-cycle multiplication and hardware division
  • 64 KB on-chip flash memory
  • 8 KB on-chip SRAM
  • Up to 40 MHz CPU clock speed
  • Multiple communication interfaces, including SPI, I2C, UART, and CAN
  • Analog-to-digital converter (ADC) with 16-bit resolution
  • Pulse-width modulation (PWM) generator
  • On-chip temperature sensor
  • Low power consumption


  • Motor control (e.g., for industrial automation, automotive, and consumer electronics)
  • Power supply control (e.g., for server, telecom, and data center)
  • Lighting control (e.g., for street lighting, stadium lighting, and smart homes)
  • Sensor processing (e.g., for health monitoring, environmental sensing, and smart agriculture)
  • Audio processing (e.g., for voice recognition, noise cancellation, and musical instruments)


Parameter Value Parameter Value
Pin Count 64 Package Category Quad Flat Packages
Released Date Dec 24, 2020


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1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.


  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The MC56F8123VFBE chip is a digital signal controller (DSC) designed by NXP Semiconductors. It combines the functionality of a microcontroller and a digital signal processor (DSP), offering high-performance processing for real-time control applications. The chip features a 16-bit central processing unit (CPU), peripherals for various interfaces, and high-speed analog-to-digital and digital-to-analog converters. It is commonly used in applications such as motor control, power conversion, and industrial automation.
  • Features

    MC56F8123VFBE is a microcontroller with these key features: 16-bit Digital Signal Controller (DSC), a 16-bit core operating up to 80MHz, built-in communication interfaces (SCI, SPI, I2C), multiple timers and PWMs, 48kB flash memory, 8kB RAM, an ADC module, and a temperature sensor. It is suitable for various embedded control applications.
  • Pinout

    The MC56F8123VFBE is a microcontroller with 144 pins. It functions as a digital signal controller (DSC) and is ideal for motor control applications.
  • Manufacturer

    MC56F8123VFBE is manufactured by NXP Semiconductors, a global semiconductor company. They provide high-performance mixed-signal and standard product solutions for automotive, industrial, mobile, and communication industries.
  • Application Field

    The MC56F8123VFBE microcontroller is commonly used in various applications such as motor control systems, power management, sensor interface, and industrial automation. Its high-performance processing capabilities and extensive communication interfaces make it suitable for demanding tasks in automotive, consumer electronics, and industrial sectors.
  • Package

    The MC56F8123VFBE chip is available in a 100-LQFP package type. The form factor is a quad flat package, and it has a size of 14mm by 14mm.

Datasheet PDF

Preliminary Specification MC56F8123VFBE PDF Download

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