ADI LTC6811HG-1#PBF

Part points

• The LTC6811HG-1#PBF is a high-precision battery monitoring integrated circuit designed for multicell battery stack applications. It provides voltage and temperature monitoring for up to 12 series-connected battery cells, with data communication through an isolated serial interface. This chip is commonly used in electric vehicles, energy storage systems, and other high-performance applications requiring accurate battery management.

• Equivalent

  Some equivalent products of the LTC6811HG-1#PBF chip are the LTC6811HG-2#PBF, LTC6811-1#PBF, and the LTC6811-2#PBF. These chips are all multi-cell battery stack monitors with the same functionality and features as the LTC6811HG-1#PBF.

• Features

  1. High-accuracy multichannel battery stack monitor 2. Measures up to 6 series connected battery cells with 0.04% max total measurement error 3. Balances cells with high accuracy and programmable PWM mayokacky 4. Extremely low power sleep mode 5. Directly communicates with microcontrollers and other host devices via SPI interface

• Pinout

  The LTC6811HG-1#PBF has a 56-pin count and is a high-voltage battery stack monitor designed to monitor up to 12 series-connected battery cells. It provides voltage and temperature measurements, as well as balancing control for each cell.

• Manufacturer

  The LTC6811HG-1#PBF is manufactured by Linear Technology, which is a subsidiary of Analog Devices Inc. Linear Technology is a leading provider of analog and mixed-signal solutions for various industries, including automotive, communication, and industrial markets. They specialize in designing high-performance integrated circuits for applications such as power management, data conversion, signal processing, and RF.

• Application Field

  The LTC6811HG-1#PBF is commonly used in high voltage battery monitoring applications, such as electric vehicles, energy storage systems, and grid storage. It is ideal for large battery stacks where precise cell balancing and monitoring is required to ensure safe and efficient operation.

• Package

  The LTC6811HG-1#PBF chip is in a 38-SSOP (0.154", 3.90mm Width) package type. It has a surface mount form factor. The size of the chip is 6.20mm x 9.70mm x 1.75mm.