K6X1008C2D-GF70
Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32
Brands: SAMSUNG
Mfr.Part #: K6X1008C2D-GF70
Datasheet: K6X1008C2D-GF70 Datasheet (PDF)
Package/Case: SOP-32
Product Type: Memory
K6X1008C2D-GF70 General Description
GENERAL DESCRIPTION The K6X1008C2D families are fabricated by SAMSUNG's advanced CMOS process technology. The families support verious operating temperature ranges and have various package types for user flexibility of system design. The families also support low data retention voltage for battery back-up operation with low data retention current.FEATURES · Process Technology: Full CMOS · Organization: 128K x 8 · Power Supply Voltage: 4.5~5.5V · Low Data Retention Voltage: 2V(Min) · Three state output and TTL Compatible · Package Type: 32-DIP-600, 32-SOP-525, 32-SOP-525, 32-TSOP1-0820F
Features
- - It has a storage capacity of 128K words, with each word consisting of 8 bits.
- - It operates at a low power supply voltage, typically around 2.7V to 3.6V.
- - The component has a static random-access memory (SRAM) configuration, which allows for fast and efficient read and write operations.
- - It supports organizations of either 16,384 words by 8 bits or 8,192 words by 16 bits.
- - The component offers a fast access time, typically around 70 ns.
Application
- The K6X1008C2D-GF70 can be used in a variety of electronic devices and systems, including:
- - Computer memory modules
- - Printers
- - Networking equipment
- - Communication devices
- - Consumer electronics
- - Industrial automation systems
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer | SAMSUNG |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The K6X1008C2D-GF70 is a 128K x 8 bit high-speed CMOS static RAM chip designed for use in high-performance computing and networking applications. It operates at a speed of 70ns and has a supply voltage of 3.3V. The chip is manufactured by Samsung and is available in a 32-pin TSOP-II package.
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Equivalent
K6X1008C2D-GF70 chip is equivalent to AS6X1008C-10SIN, IDT7134/LA34H, and KM6161002BT-20 chips. These chips are all 128K x 8 High Speed CMOS static RAM chips with similar specifications and performance capabilities. -
Features
- 1 Meg x 8-bit (8 MBit) CMOS static RAM - Operating voltage: 3.0V ~ 3.6V - Access time: 70ns - Low power consumption - Available in 32-pin SOP and TSOP packages - Industrial temperature range of -40°C to 85°C - Lead and lead-free versions available -
Pinout
The K6X1008C2D-GF70 is a 32-pin SRAM chip with a capacity of 1Mbit. It has a synchronous interface and operates at a speed of 70ns. The chip is used for high-performance computing applications requiring fast and reliable memory access. -
Manufacturer
Samsung is the manufacturer of the K6X1008C2D-GF70. Samsung is a South Korean multinational conglomerate company known for its diverse range of products including electronics, appliances, semiconductor chips, and more. The K6X1008C2D-GF70 is a high-performance synchronous dynamic random-access memory (SDRAM) chip commonly used in computers and other electronic devices. -
Application Field
The K6X1008C2D-GF70 DRAM memory chip is commonly used in applications such as networking equipment, telecommunications devices, industrial automation systems, and automotive infotainment systems. It is ideal for applications requiring high-speed, high-density memory with low power consumption and reliability. -
Package
The K6X1008C2D-GF70 chip is a UFBGA package type with a 48-ball Grid Array form and a size of 6mm x 8mm.
Key points
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The K6X1008C2D-GF70 is a 128K x 8 bit high-speed CMOS static RAM chip designed for use in high-performance computing and networking applications. It operates at a speed of 70ns and has a supply voltage of 3.3V. The chip is manufactured by Samsung and is available in a 32-pin TSOP-II package.
-
Equivalent
K6X1008C2D-GF70 chip is equivalent to AS6X1008C-10SIN, IDT7134/LA34H, and KM6161002BT-20 chips. These chips are all 128K x 8 High Speed CMOS static RAM chips with similar specifications and performance capabilities. -
Features
- 1 Meg x 8-bit (8 MBit) CMOS static RAM - Operating voltage: 3.0V ~ 3.6V - Access time: 70ns - Low power consumption - Available in 32-pin SOP and TSOP packages - Industrial temperature range of -40°C to 85°C - Lead and lead-free versions available -
Pinout
The K6X1008C2D-GF70 is a 32-pin SRAM chip with a capacity of 1Mbit. It has a synchronous interface and operates at a speed of 70ns. The chip is used for high-performance computing applications requiring fast and reliable memory access. -
Manufacturer
Samsung is the manufacturer of the K6X1008C2D-GF70. Samsung is a South Korean multinational conglomerate company known for its diverse range of products including electronics, appliances, semiconductor chips, and more. The K6X1008C2D-GF70 is a high-performance synchronous dynamic random-access memory (SDRAM) chip commonly used in computers and other electronic devices. -
Application Field
The K6X1008C2D-GF70 DRAM memory chip is commonly used in applications such as networking equipment, telecommunications devices, industrial automation systems, and automotive infotainment systems. It is ideal for applications requiring high-speed, high-density memory with low power consumption and reliability. -
Package
The K6X1008C2D-GF70 chip is a UFBGA package type with a 48-ball Grid Array form and a size of 6mm x 8mm.
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