K4H561638H-UCB3
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66,
Brands: Samsung
Mfr.Part #: K4H561638H-UCB3
Datasheet: K4H561638H-UCB3 Datasheet (PDF)
Package/Case: TSSOP66
Product Type: MCU
K4H561638H-UCB3 General Description
Consumer Memory
Features
- 1. It has a capacity of 1 gigabit (128 Megabytes) per module.
- 2. The data transfer rate is 667 Megabits per second.
- 3. It operates on a supply voltage of 1.8V.
- 4. This module offers a burst length of 4 or 8.
Application
- 1. This component is commonly used in desktop and laptop computers for memory expansion.
- 2. It can be found in various consumer electronics like gaming consoles, set-top boxes, and digital televisions.
- 3. It is also utilized in networking devices such as routers and switches.
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC |
ECCN Code | EAR99 | HTS Code | 8542.32.00.24 |
Samacsys Manufacturer | SAMSUNG | Access Time-Max | 0.7 ns |
Clock Frequency-Max (fCLK) | 166 MHz | I/O Type | COMMON |
Interleaved Burst Length | 2,4,8 | JESD-30 Code | R-PDSO-G66 |
JESD-609 Code | e6 | Memory Density | 268435456 bit |
Memory IC Type | DDR1 DRAM | Memory Width | 16 |
Moisture Sensitivity Level | 3 | Number of Terminals | 66 |
Number of Words | 16777216 words | Number of Words Code | 16000000 |
Operating Temperature-Max | 70 °C | Operating Temperature-Min | |
Organization | 16MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TSSOP |
Package Equivalence Code | TSSOP66,.46 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 2.3 V | Qualification Status | Not Qualified |
Refresh Cycles | 8192 | Sequential Burst Length | 2,4,8 |
Standby Current-Max | 0.003 A | Supply Current-Max | 0.33 mA |
Supply Voltage-Nom (Vsup) | 2.3 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | COMMERCIAL |
Terminal Finish | TIN BISMUTH | Terminal Form | GULL WING |
Terminal Pitch | 0.635 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The K4H561638H-UCB3 chip is a high-density synchronous dynamic random-access memory (SDRAM) chip commonly used in electronics such as smartphones, tablets, and other devices. It offers fast data transfer speeds and high storage capacity, making it ideal for demanding applications that require quick and efficient data processing.
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Equivalent
The equivalent products of K4H561638H-UCB3 chip are Hynix HY5PS1G831C and Samsung K4H511638G-LCCC chips. They have similar specifications and can be used as alternatives for the K4H561638H-UCB3 chip. -
Features
The K4H561638H-UCB3 is a 512MB DDR SDRAM module with a 64Mx64 configuration. It operates at a high-speed clock frequency of 166MHz and is organized as a 4-bank / 4-bank x 8,192 refresh (8,192 cycle), with a 64ms. The module supports 400MHz and is ideal for applications requiring high-speed memory functionality. -
Pinout
The K4H561638H-UCB3 is a 512Mb DDR SDRAM chip with a 66-pin package. It has a 66-pin ball grid array (BGA) configuration and is used in computer memory modules. The pin functions include power supply, address inputs, data inputs/outputs, clock inputs, and control signals. -
Manufacturer
The manufacturer of the K4H561638H-UCB3 is Samsung. Samsung is a South Korean multinational conglomerate company that specializes in electronics, mobile devices, semiconductors, and other technology products. Samsung is one of the largest technology companies in the world and a leading producer of memory chips and other semiconductor components. -
Application Field
The K4H561638H-UCB3 is a 512MB DDR SDRAM module commonly used in desktop computers, laptops, networking equipment, and industrial applications. It is particularly suitable for high-performance computing tasks such as gaming, multimedia editing, and graphics rendering. -
Package
The K4H561638H-UCB3 chip comes in a Ball Grid Array (BGA) package. It is in the form of a memory module and has a size of 54mm x 90mm.
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