Renesas HD6417705F133BV
32-bit Microcontrollers - MCU MPU 3V 0K Pb-free 208 FP
Brands: Renesas Technology Corp
Mfr.Part #: HD6417705F133BV
Datasheet: HD6417705F133BV Datasheet (PDF)
Package/Case: QFP-20
RoHS Status:
Stock Condition: 3550 pcs, New Original
Product Type: Embedded Processors & Controllers
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $94.780 | $94.780 |
192 | $37.818 | $7261.056 |
504 | $36.555 | $18423.720 |
1008 | $35.930 | $36217.440 |
In Stock:3550 PCS
HD6417705F133BV General Description
The SH7705 microprocessor incorporates the 32-bit SH-3 CPU and has large size Cache (32KB) and built-in USB Function. It also actualizes low power consumption 200mW (typ)&(@ 133MHz).
Specifications
Parameter | Value | Parameter | Value |
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Pin Count | 208 | Package Category | Quad Flat Packages |
Released Date | Dec 20, 2019 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The HD6417705F133BV is a microcontroller chip designed for embedded systems. It features a 32-bit RISC CPU, on-chip memory, and various peripherals, making it suitable for applications in industrial control, consumer electronics, and automotive systems. Its versatile capabilities and compact design make it an attractive choice for developers seeking a high-performance microcontroller solution.
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Features
The HD6417705F133BV is a microcontroller unit developed by Renesas. It features a 32-bit RISC processor, operating at a clock speed of 133MHz, with various integrated peripherals such as timers, serial interfaces, analog-to-digital converters, and memory interfaces. It is commonly used in industrial control systems and consumer electronics applications. -
Pinout
The HD6417705F133BV is a microcontroller with 100 pins. It performs various functions such as computing, data processing, and controlling external devices through its input/output pins. -
Manufacturer
The manufacturer of the HD6417705F133BV is Renesas Electronics Corporation. Renesas Electronics is a Japanese semiconductor manufacturing company that designs and produces a wide range of integrated circuits, microcontrollers, and system-on-a-chip (SoC) products for various industries, including automotive, consumer electronics, and industrial applications. -
Application Field
The HD6417705F133BV is a microcontroller primarily used in industrial automation, automotive control, and consumer electronics. It is designed for applications that require real-time control, high-performance processing capabilities, and reliable operation in harsh environments. -
Package
The HD6417705F133BV chip has a package type known as BGA (Ball Grid Array), a form of an integrated circuit package. Its size is not explicitly mentioned, but BGA chips typically have a square or rectangular shape, with dimensions measured in millimeters.
Datasheet PDF
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