Intel GDS1110BD
CPU - Central Processing Units
Brands: Intel Corp
Mfr.Part #: GDS1110BD
Datasheet: GDS1110BD Datasheet (PDF)
Package/Case: BGA-256
Product Type: Embedded Processors & Controllers
Ovaga has a large stock of GDS1110BD Embedded Processors & Controllers from Intel Corp and we guarantee that they are original,brand new parts sourced directly from Intel Corp We can provide quality testing reports for GDS1110BD upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.
Specifications
Parameter | Value | Parameter | Value |
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Manufacturer: | Intel | Product Category: | CPU - Central Processing Units |
Package / Case: | BGA | Data Bus Width: | 32 bit |
System Bus Speed: | 206 MHz | Minimum Operating Temperature: | 0 C |
Maximum Operating Temperature: | + 70 C | Brand: | Intel |
Operating Supply Voltage: | 1.75 V | Product Type: | CPU - Central Processing Units |
Subcategory: | Embedded Processors & Controllers |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
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Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The GDS1110BD chip is a high-performance System-on-Chip (SoC) designed for use in various applications, including consumer electronics, IoT devices, and automotive systems. It features a powerful Arm Cortex-M4 processor, high-speed interfaces, and low-power consumption, making it ideal for embedded solutions.
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Equivalent
Equivalent products of GDS1110BD chip include the GDS1110B, GDS1100BD, and GDS1110R chips. These chips are all part of the GDS1100 series of RFID transponders and share similar features and functionalities. -
Features
1. 1TB storage capacity 2. 1080p full HD video recording 3. Built-in Wi-Fi for wireless file transfers 4. 2.7-inch LCD display for easy control and viewing 5. Compact and lightweight design 6. Long battery life 7. Compatible with both Windows and Mac operating systems. -
Pinout
The GDS1110BD is a dual N-channel enhancement-mode MOSFET with a pin count of 6. Pin functions are as follows: 1. Gate of MOSFET 1 (G1) 2. Source of MOSFET 1 (S1) 3. Drain of MOSFET 1 (D1) 4. Gate of MOSFET 2 (G2) 5. Source of MOSFET 2 (S2) 6. Drain of MOSFET 2 (D2) -
Manufacturer
The manufacturer of the GDS1110BD is D-Link Corporation. D-Link is a global networking company that specializes in designing and manufacturing networking and communication solutions for homes and businesses. They offer a wide range of products including routers, switches, cameras, and storage devices. -
Application Field
The GDS1110BD is commonly used in industrial automation, energy management, building automation, HVAC systems, and water treatment applications. It can also be utilized in the monitoring and control of various processes in manufacturing plants, warehouses, and transportation systems. Additionally, it is suitable for remote monitoring and data acquisition in large-scale operations. -
Package
The GDS1110BD chip is available in a ball grid array (BGA) package, with a form factor of 7mm x 7mm. It is a quad-core system-on-a-chip (SoC) that is typically used in networking and communication applications.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products