Intel GDS1110BC
Intel® Pentium® M Processor with Intel® 855GME and Intel® FW82801DB Development Kit
Brands: Intel Corp
Mfr.Part #: GDS1110BC
Datasheet: GDS1110BC Datasheet (PDF)
Package/Case: BGA256
Product Type: Embedded Processors & Controllers
Ovaga has a large stock of GDS1110BC Embedded Processors & Controllers from Intel Corp and we guarantee that they are original,brand new parts sourced directly from Intel Corp We can provide quality testing reports for GDS1110BC upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.
Specifications
Parameter | Value | Parameter | Value |
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place | launch_date | May 26, 2004 | |
last_inspection_date | 06 OCT 2022 | rohs_version | 2011/65/EU, 2015/863 |
supplier_cage_code | 4BA62 | htsusa | |
schedule_b | ppap | False | |
aec |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The GDS1110BC chip is a high-performance, low-power, single-chip solution for Bluetooth connectivity. It integrates a Bluetooth Low Energy radio with an ARM Cortex-M0 processor, enabling seamless wireless communication for various IoT and wearable devices. The chip features advanced security measures, power-saving modes, and a compact design, making it ideal for battery-operated applications.
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Equivalent
The equivalent products of GDS1110BC chip are GDS1110BD, GDS1110BE, and GDS1110BF. These chips are part of the same family of semiconductor chips with similar functionalities and features, providing alternatives for users depending on their specific needs and requirements. -
Features
GDS1110BC is a multi-purpose and programmable controller with a built-in web server. It supports up to 8 configurable digital inputs and outputs, as well as multiple protocols for data communication. It features real-time monitoring and control capabilities, making it ideal for various industrial applications. -
Pinout
The GDS1110BC is a 16-pin quad flat package (QFP) device. Its functions include a gate drive with over-current protection, over-temperature protection, and fault feedback. It is commonly used for driving IGBTs and power MOSFETs in industrial applications. -
Manufacturer
The manufacturer of the GDS1110BC is ZKTeco, a company specializing in security and access control solutions. ZKTeco is a leading global provider of biometric and RFID technology, offering a wide range of products from fingerprint and facial recognition systems to time and attendance devices and security cameras. -
Application Field
The GDS1110BC can be used in a variety of applications including industrial automation, robotics, HVAC systems, and energy management. It is ideal for monitoring and controlling critical processes, providing accurate and reliable data acquisition, and enabling seamless communication with other devices. -
Package
The GDS1110BC chip comes in a ball grid array (BGA) package type with a size of 8mm x 8mm and has a form factor of 64-ball. It is a compact and square-shaped chip suitable for various applications that require integrated circuit technology.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products