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FT245BM

UART IC 1, UART Channel 384 Byte, 128 Byte 32-LQFP (7x7)

ISO14001 ISO9001 DUNS

Brands: FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

Mfr.Part #: FT245BM

Datasheet: FT245BM Datasheet (PDF)

Package/Case: 32-LQFP (7x7)

Product Type: FIFO

RoHS Status:

Stock Condition: 9793 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for FT245BM or email to us: Email: [email protected], we will contact you within 12 hours.

FT245BM General Description

UART IC 1, UART Channel 384 Byte, 128 Byte 32-LQFP (7x7)

Features

  • Single chip USB to parallel FIFO bidirectional data transfer interface.
  • Entire USB protocol handled on the chip. No USB specific firmware programming required.
  • Fully integrated 1024 bit EEPROM storing device descriptors and FIFO I/O configuration.
  • Fully integrated USB termination resistors.
  • Fully integrated clock generation with no external crystal required.
  • Data transfer rates up to 1Mbyte / second.
  • 128 byte receive buffer and 256 byte transmit
  • buffer utilising buffer smoothing technology to
  • allow for high data throughput.
  • FTDI‟s royalty-free Virtual Com Port (VCP) and
  • Direct (D2XX) drivers eliminate the
  • requirement for USB driver development in
  • most cases.
  • Unique USB FTDIChip-ID™ feature.
  • Configurable FIFO interface I/O pins.
  • Synchronous and asynchronous bit bang interface options.

Specifications

Parameter Value Parameter Value
Rohs Code No Part Life Cycle Code Obsolete
Ihs Manufacturer FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD Part Package Code QFP
Package Description LQFP, Pin Count 32
Reach Compliance Code not_compliant HTS Code 8542.31.00.01
Samacsys Manufacturer FTDI Chip JESD-30 Code S-PQFP-G32
JESD-609 Code e0 Length 7 mm
Moisture Sensitivity Level 3 Number of Terminals 32
Operating Temperature-Max 70 °C Operating Temperature-Min
Package Body Material PLASTIC/EPOXY Package Code LQFP
Package Shape SQUARE Package Style FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 250 Qualification Status Not Qualified
Seated Height-Max 1.6 mm Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.35 V Supply Voltage-Nom 5 V
Surface Mount YES Technology CMOS
Temperature Grade COMMERCIAL Terminal Finish TIN LEAD
Terminal Form GULL WING Terminal Pitch 0.8 mm
Terminal Position QUAD Width 7 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The FT245BM is a USB to parallel FIFO interface chip developed by FTDI. It allows for easy connection to parallel devices, such as printers and scanners, through USB. The chip provides a fast data transfer rate and is commonly used in embedded systems, industrial automation, and testing equipment.
  • Equivalent

    Some equivalent products of the FT245BM chip are the FT245R, FT232R, and FT2232C. These chips are USB to parallel FIFO interface chips produced by FTDI (Future Technology Devices International). They offer similar functionalities as the FT245BM chip for USB communication with parallel FIFO interfaces.
  • Features

    - High speed USB to parallel FIFO interface - Low operating voltage (3.3V and 5V) - USB 2.0 Full Speed compatible - Data transfer rates up to 1MByte/sec - 12MHz internal clock option - 1,024 byte receive buffer and 256 byte transmit buffer - Compact 32-pin QFN package
  • Pinout

    The FT245BM is a USB to parallel FIFO interface IC with a 28-pin SSOP package. It offers a 2-wire UART data transfer with 2 physical UART interfaces. It has 8-bit parallel FIFO data bus, 4 control lines, and supports USB Full-Speed (12Mbps) communication.
  • Manufacturer

    FT245BM is manufactured by Future Technology Devices International Limited (FTDI). FTDI is a semiconductor company that specializes in providing innovative and cost-effective solutions for USB connectivity and display interfaces. They offer a wide range of products including USB controllers, converters, and modules for various industrial, commercial, and consumer applications.
  • Application Field

    The FT245BM is commonly used in applications requiring high-speed data transfer between USB and parallel interfaces, such as data acquisition, test and measurement equipment, industrial control systems, and other applications that require fast data transfer rates. Additionally, it is utilized in applications involving development tools and programming adapters.
  • Package

    The FT245BM chip typically comes in a SSOP-28 package, with a form factor of surface-mount and a size of 10.20mm x 5.30mm x 1.70mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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