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Altera EP1C12F324I7N

FPGA Cyclone® Family 12060 Cells 320.1MHz 130nm Technology 1.5V 324-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP1C12F324I7N

Datasheet: EP1C12F324I7N Datasheet (PDF)

Package/Case: FBGA-324

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,088 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for EP1C12F324I7N or email to us: Email: [email protected], we will contact you within 12 hours.

EP1C12F324I7N General Description

Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA

ep1c12f324i7n

Features

  • Device family: Cyclone I
  • Number of logic elements: 12,288
  • Number of memory blocks: 288 Kbits
  • Number of PLLs: 2
  • Maximum number of user I/Os: 266
  • Package: FBGA (Fine-Pitch Ball Grid Array)
  • Operating voltage: 1.2V
ep1c12f324i7n
ep1c12f324i7n

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® feature-process-technology 130nm
feature-maximum-number-of-user-i-os 249 feature-number-of-registers
feature-device-logic-cells 12060 feature-device-system-gates
feature-number-of-multipliers feature-program-memory-type SRAM
feature-ram-bits-kbit 234 feature-total-number-of-block-ram 52
feature-ethernet-macs feature-supported-ip-core Video LVDS SerDes Transmitter / Receiver|RLDRAM II Controller Core|IFI Advanced CAN IP
feature-supported-ip-core-manufacture Microtronix Inc/CAST, Inc/Northwest Logic, Inc/IFI feature-maximum-number-of-serdes-channels
feature-device-logic-units 12060 feature-device-number-of-dlls-plls 2
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp feature-pci-blocks
feature-programmability No feature-maximum-internal-frequency-mhz 320.1
feature-speed-grade 7 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported LVDS|PCI feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|SSTL-2|SSTL-3
feature-external-memory-interface DDR SDRAM|FCRAM feature-minimum-operating-supply-voltage-v 1.425
feature-maximum-operating-supply-voltage-v 1.575 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 324 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991d.
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP1C12F324I7N chip is a field-programmable gate array (FPGA) from Intel's Cyclone series. It features 12,000 logic elements, 324 input/output pins, and is designed for low-power applications. The chip supports digital signal processing, memory interfacing, and system integration in various electronic devices.
  • Equivalent

    The EP1C12F324I7N chip is part of the Intel Cyclone series of FPGA chips. Equivalent products include EP1C12F324C8, EP1C12F324I7, and EP1C12F324I8N. These chips have similar functionality and can be used as replacements for the EP1C12F324I7N.
  • Features

    The EP1C12F324I7N is a member of the Altera Cyclone FPGA family with 12,060 logic elements, 324 embedded memory blocks, and 7 high-speed transceivers. It also features support for various communication protocols, such as PCI Express and Gigabit Ethernet, making it ideal for high-performance applications.
  • Pinout

    The EP1C12F324I7N is a 324-pin BGA FPGA (Field-Programmable Gate Array) from Altera. It features 324 I/O pins and has multiple functions such as logic functions, memory functions, and digital signal processing functions.
  • Manufacturer

    The EP1C12F324I7N is manufactured by Altera Corporation, a semiconductor company known for its programmable logic devices such as field-programmable gate arrays (FPGAs). Altera was acquired by Intel Corporation in 2015 and is now part of Intel's Programmable Solutions Group, focusing on providing solutions for various industries such as telecommunications, automotive, and industrial applications.
  • Application Field

    The EP1C12F324I7N is commonly used in applications such as industrial automation, telecommunications, automotive, and consumer electronics. It is often used for signal processing, data encryption, and control systems due to its high performance and low power consumption capabilities.
  • Package

    The EP1C12F324I7N chip is a BGA package type with a 324-pin count. It is in a RoHS-compliant form, meaning it is lead-free and environmentally friendly. The size of the chip is 17mm x 17mm.

Datasheet PDF

Preliminary Specification EP1C12F324I7N PDF Download

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  • quantity

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    365 days quality guarantee for all products

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