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Infineon CY62167DV30LL-55ZXI

Compact SRAM IC with a 16Mb capacity

ISO14001 ISO9001 DUNS

Brands: Infineon

Mfr.Part #: CY62167DV30LL-55ZXI

Datasheet: CY62167DV30LL-55ZXI Datasheet (PDF)

Package/Case: PG-TSOP-48

Product Type: Memory

RoHS Status:

Stock Condition: 2105 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Please submit RFQ for CY62167DV30LL-55ZXI or email to us: Email: [email protected], we will contact you within 12 hours.

CY62167DV30LL-55ZXI General Description

The CY62167DV30LL-55ZXI is a high-performance, low-power static random access memory (SRAM) chip manufactured by Cypress Semiconductor. It has a storage capacity of 16 megabits (2 megabytes) and operates at a voltage of 1.7V to 3.6V. This particular model is designed to operate at a speed of 55 nanoseconds, making it suitable for applications that require fast and reliable data storage and retrieval. It features a synchronous interface and has a standby current of just 0.1μA, making it ideal for battery-powered devices or other power-sensitive applications.The CY62167DV30LL-55ZXI also includes a deep power-down mode to further minimize power consumption when the chip is not in use. It is offered in a Lead (Pb)-free and RoHS-compliant package, making it environmentally friendly as well.

cy62167dv30ll55zxi

Features

  • CY62167DV30LL-55ZXI is a low-power CMOS static RAM
  • Integrated circuit with 4Mbit memory size
  • Operating voltage of 2.0V to 3.6V
  • High speed access time of 55ns
  • Low standby current consumption
  • Wide temperature range of -40°C to 85°C

Application

  • Portable electronics
  • Wireless communication devices
  • Digital cameras
  • Industrial equipment
  • Automotive systems
  • Medical devices
  • Gaming systems
  • Consumer electronics
  • Networking equipment
  • Instrumentation and measurement devices

Specifications

Parameter Value Parameter Value
functionalPacking TRAY addProductInfo 16 Mb 3.3V Parallel MoBL TM SRAM Ind, TSOP-48
packageNameMarketing TSOP-I-48 (51-85183) msl 3
halogenFree yes customerInfo STANDARD
fgr C21 productClassification COM
productStatusInfo active and preferred hfgr A
packageName PG-TSOP-48 pbFree yes
moistureProtPack DRY orderingCode SP005638731
fourBlockPackageName PG-TSOP-48-803 rohsCompliant yes
opn CY62167DV30LL-55ZXI completelyPbFree yes
sapMatnrSali SP005638731

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the CY62167DV30LL-55ZXI component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   AS6C1616-55TIN

Brands :  

Package :  

Description :  

Part Number :   K6R1016C1C-JI10

Brands :  

Package :  

Description :  

Part Number :   M68AF127BM70MC6

Brands :  

Package :  

Description :  

Part Number :   HYB39S16160T-8

Brands :  

Package :  

Description :  

Part Number :   IS62WV25616BLL-55BLI

Brands :  

Package :  

Description :  

Part points

  • The CY62167DV30LL-55ZXI is a chip that falls under the category of synchronous SRAM (Static Random Access Memory). It has a density of 16 Mb and operates at a voltage of 1.7V to 2.0V. This chip offers low power consumption and fast access times, making it suitable for various applications, such as portable electronics, network storage, and automotive systems.

  • Equivalent

    The equivalent products of the CY62167DV30LL-55ZXI chip include the ISSI IS61LV25616AL, the Samsung K6R4016V1D-JI10, and the Micron MT45W8MW16BGX-701 WT:B.

  • Features

    CY62167DV30LL-55ZXI is a synchronous low-power SRAM device with a 16-Mbit density and a 3.0V to 3.6V operating range. It has a fast access time of 55 ns, low power consumption, and it operates in low voltage and low power standby modes. It offers automatic power-down and a software-controlled output enable for reduced power consumption.

  • Pinout

    The CY62167DV30LL-55ZXI is a 3.0V synchronous SRAM with a pin count of 44. It is used in applications that require high-performance memory with low power consumption.

  • Manufacturer

    The manufacturer of the CY62167DV30LL-55ZXI is Cypress Semiconductor. Cypress Semiconductor is an American semiconductor design and manufacturing company.

  • Application Field

    The CY62167DV30LL-55ZXI is a 3.0V 16M (1M x 16) MoBL synchronous dual-port RAM. It is commonly used in applications that require high performance, low power, and space-constrained designs, such as networking equipment, telecommunications, automotive systems, industrial automation, and medical devices.

  • Package

    The CY62167DV30LL-55ZXI chip is packaged in a 44-ball Very Thin BGA (VFBGA) form with a size of 5mm x 5mm.

S25FL116K0XMFA043

S25FL164K0XNFI011

S25FL164K0XMFI001

S25FL128SAGMFI001

S25FL256SAGNFI000

S25FL512SAGBHIA10

S70FL01GSAGMFI011

S25FL256SAGMFI001

S70FL01GSAGMFI010

S25FL512SAGMFIR11

S25FL128SAGBHIA00

S25FL512SAGMFI013

S25FL256SAGMFI000

S25FL256SAGNFI003

S25FL256SAGMFIR01

S25FL128SAGBHI200

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NTMFS5C628NLT1G

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HMC8413LP2FE

ISL1208IB8Z

L78L12ABUTR

Datasheet PDF

Preliminary Specification CY62167DV30LL-55ZXI PDF Download

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