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Infineon S70FL01GSAGMFI011

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V 1G-bit 128M x 8 16-Pin SOIC W Tube

ISO14001 ISO9001 DUNS

Brands: Infineon Technologies Corporation

Mfr.Part #: S70FL01GSAGMFI011

Datasheet: S70FL01GSAGMFI011 Datasheet (PDF)

Package/Case: SOP16

Product Type: Memory

RoHS Status:

Stock Condition: 3,518 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for S70FL01GSAGMFI011 or email to us: Email: [email protected], we will contact you within 12 hours.

S70FL01GSAGMFI011 General Description

FLASH - NOR Memory IC 1Gbit SPI - Quad I/O 133 MHz 16-SOIC

Specifications

Parameter Value Parameter Value
RHoS yes PBFree yes
HalogenFree yes feature-organization
feature-minimum-operating-supply-voltage-v 2.7 feature-maximum-access-time-ns
feature-process-technology feature-maximum-operating-supply-voltage-v 3.6
feature-maximum-operating-current-ma 100 feature-packaging Tube
feature-rad-hard feature-pin-count 16
feature-supplier-package SOIC W feature-standard-package-name1 SO
feature-cecc-qualified No feature-esd-protection
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991.b.1.a
feature-svhc

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The S70FL01GSAGMFI011 chip is a high-performance, 1 Gb NAND Flash memory device. It offers fast read and program times, making it suitable for applications requiring high data bandwidth. The chip supports extended temperature ranges and offers multiple protection features, ensuring data integrity in different environments. It is commonly used in automotive, industrial, and networking applications that demand reliable and high-density storage solutions.
  • Equivalent

    Equivalent products of the S70FL01GSAGMFI011 chip include S25FL01GS, S70FL01GS, S70FL03GS, and S70FL05GS. These chips are similar in function and offer comparable features and specifications.
  • Features

    The S70FL01GSAGMFI011 is a 1Gb NOR Flash memory device. It has a high-speed serial interface, operates at 3V, and offers fast read and program access times. It also features flexible erase capabilities, security features, and a wide operating temperature range, making it suitable for a variety of applications.
  • Pinout

    The S70FL01GSAGMFI011 is a 24-ball controlled burst architecture (CBA) NAND flash memory device. It is offered in a 8x14mm WSON package. The pin count is 24. The pins perform various functions including data input/output, address inputs, command inputs, and control signals for chip enable, write enable, and output enable.
  • Manufacturer

    The manufacturer of the S70FL01GSAGMFI011 is Cypress Semiconductor. Cypress Semiconductor is an American company that designs and manufactures a wide range of digital and analog integrated circuits and embedded systems solutions. They specialize in providing semiconductor solutions for automotive, industrial, consumer electronics, and IoT applications.
  • Application Field

    The S70FL01GSAGMFI011 is a flash memory chip commonly used in applications such as automotive infotainment systems, industrial control systems, network routers, and solid-state drives (SSDs). It provides reliable and high-performance storage solutions for these applications, offering fast read and write speeds, large capacity, and enhanced data security.
  • Package

    The S70FL01GSAGMFI011 chip is of a package type known as 48-ball BGA (Ball Grid Array). It comes in a standard form factor with a size of 8mm x 6mm.

Datasheet PDF

Preliminary Specification S70FL01GSAGMFI011 PDF Download

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  • Product

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  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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