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Infineon BSB013NE2LXI
N-Channel 25 V 36A (Ta), 163A (Tc) 2.8W (Ta), 57W (Tc) Surface Mount MG-WDSON-2, CanPAK M™
Brands: Infineon Technologies Corporation
Mfr.Part #: BSB013NE2LXI
Datasheet: BSB013NE2LXI Datasheet (PDF)
Package/Case: WDSON-2
RoHS Status:
Stock Condition: 3860 pcs, New Original
Product Type: Transistors
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $1.958 | $1.958 |
| 200 | $0.758 | $151.600 |
| 500 | $0.731 | $365.500 |
| 1000 | $0.719 | $719.000 |
In Stock:3860 PCS
BSB013NE2LXI General Description
N-Channel 25 V 36A (Ta), 163A (Tc) 2.8W (Ta), 57W (Tc) Surface Mount MG-WDSON-2, CanPAK M™
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| IDpuls max | 400.0 A | VGS(th) max | 2.0 V |
| VGS(th) min | 1.2 V | Ptot max | 57.0 W |
| VDS max | 25.0 V | Polarity | N |
| Operating Temperature max | 150.0 °C | Operating Temperature min | -40.0 °C |
| Mounting | SMD | RDS (on) max | 1.8 mΩ |
| Special Features | Monolithically Integrated Schottky-like Diode | Micro-stencil | IRF66MX-25 |
| Package | DirectFET(M) |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BSB013NE2LXI chip is a high-performance system-on-a-chip (SoC) designed for use in mobile devices, IoT devices, and other connected devices. It features a multi-core processor, integrated graphics, and support for wireless connectivity standards like Wi-Fi and Bluetooth. This chip offers a balance of power efficiency and processing performance for a variety of applications.
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Equivalent
The equivalent products of BSB013NE2LXI chip are Texas Instruments BQ51013BYFPR, Analog Devices ADP165SETZ-RL7, and Linear Technology LTC3588IUFD#PBF. These chips are considered as functional alternatives with similar features and specifications for power management applications. -
Features
BSB013NE2LXI is a 6.9-inch TFT display with a resolution of 720 x 1640 pixels, a 13MP main camera, 4000mAh battery, 3GB RAM, and 32GB internal storage. It runs on Android 10 and features a MediaTek Helio A22 processor. Additionally, it has a fingerprint sensor and facial recognition for security. -
Pinout
The BSB013NE2LXI is a 6-pin Schottky Barrier Diode with a maximum forward voltage of 0.51V and a maximum reverse current of 0.5μA. Pin 1 is the cathode, Pin 2 is the anode, and Pin 3 is the backside connection for thermal management. -
Manufacturer
BSB013NE2LXI is manufactured by Infineon Technologies, a German semiconductor company specializing in power and sensor systems. They produce a wide range of products for various industries including automotive, industrial, and consumer electronics. Infineon Technologies is known for their innovative solutions in power management, microcontrollers, and connectivity technologies. -
Application Field
The BSB013NE2LXI is commonly used in applications such as automotive powertrain systems, industrial motor control, and power supply units. It is also suitable for use in solar inverters, battery management systems, and uninterruptible power supplies due to its high efficiency and low on-state resistance. -
Package
The BSB013NE2LXI chip comes in a package type of D2PAK, with a form of tube packaging, and a size of 3.3mm x 10.5mm.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
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