This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

Images are for reference only See Product Specifications

Intel BD82C602J

Name: BD82C602J
Rating: 4.5 (6 reviews)

Chipsets

Brands: Intel Corp

Mfr.Part #: BD82C602J

Datasheet: BD82C602J Datasheet (PDF)

Package/Case: BGA

Product Type: Integrated Circuits (ICs)

RoHS Status:

Stock Condition: 2251 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Add To Bom

Quick Quote

Please submit RFQ for BD82C602J or email to us: Email: [email protected], we will contact you within 12 hours.

Quantity^*

Email^*

Contact Name^*

Company

Remark

Ovaga has a large stock of BD82C602J Integrated Circuits (ICs) from Intel Corp and we guarantee that they are original,brand new parts sourced directly from Intel Corp We can provide quality testing reports for BD82C602J upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.

Specifications

Parameter	Value	Parameter	Value
Manufacturer:	Intel	Product Category:	Chipsets
Brand:	Intel	Product Type:	Chipsets
Subcategory:	Chipsets

Shipping

	Ship Fee	Lead Time
DHL	$20.00-$40.00 (0.50 KG)	2-5 days
Fedex	$20.00-$40.00 (0.50 KG)	2-5 days
UPS	$20.00-$40.00 (0.50 KG)	2-5 days
TNT	$20.00-$40.00 (0.50 KG)	2-5 days
EMS	$20.00-$40.00 (0.50 KG)	2-5 days
REGISTERED AIR MAIL	$20.00-$40.00 (0.50 KG)	2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment		Hand Fee
	Wire Transfer	charge US$30.00 banking fee.
	Paypal	charge 4.0% service fee.
	Credit Card	charge 3.5% service fee.
	Western Union	charge US.00 banking fee.
	Money Gram	charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

Step1 :Product
Step2 :Vacuum packaging
Step3 :Anti-static bag
Step4 :Individual packaging
Step5 :Packaging boxes
Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Part points

The BD82C602J is a platform controller hub chip developed by Intel. It is designed for use in desktop computers and is compatible with Intel's Core processors. The chip features integrated graphics, USB, and SATA controllers, making it a versatile option for system builders looking to create high-performance desktop systems.
Equivalent

The equivalent products of BD82C602J chip are Intel C602, Q65, Q67, H61, H67, and Z68 chipsets, all from Intel Corporation.
Features

BD82C602J is a communication chipset designed for industrial applications. It features support for multiple communication protocols, such as USB, PCIe, and SATA. It also includes integrated graphics, ECC memory support, and low-power consumption for reliable operation in demanding environments.
Pinout

The Intel BD82C602J is a PCH (Platform Controller Hub) chip with a pin count of 781 pins. It supports features such as USB, SATA, PCIe, and Ethernet connectivity, and is designed for use in server and workstation applications.
Manufacturer

The manufacturer of BD82C602J is Intel Corporation. Intel is a multinational corporation that designs and manufactures semiconductors and computer-related technologies. They are one of the largest semiconductor chip makers in the world, known for their processors and other components used in computers, servers, and other electronic devices.
Application Field

BD82C602J is commonly used in industrial automation, robotics, network communication, and small form factor embedded systems due to its high performance and energy efficiency. It is also utilized in applications that require a high level of computing power and data processing capabilities.
Package

The BD82C602J chip is a FCBGA package (Flip Chip Ball Grid Array) in a 25mm x 27mm size.