BROADCOM BCM5755KFBG
Ethernet ICs Intergrated GbE Controller
Brands: BROADCOM
Mfr.Part #: BCM5755KFBG
Datasheet: BCM5755KFBG Datasheet (PDF)
Package/Case: BGA
Product Type: Communication & Networking ICs
RoHS Status:
Stock Condition: 3554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomBCM5755KFBG General Description
The BCM5751 is a fully integrated 10/100/1000BASE-T Gigabit Ethernet media access control and physical layer transceiver solution for high-performance network applications. The BCM5751 combines a triple-speed, IEEE 802.3 compliant media access controller (MAC), PCI Express bus interface, on-chip buffer memory, and integrated physical layer transceiver in a single device. It is fabricated in a low-voltage silicon process, providing an ultra-low power solution. By itself the BCM5751 provides a complete single-chip Gigabit Ethernet NIC or LOM solutionFEATURES • Single-chip device for desktop LAN-on-Motherboard (LoM) or network interface card (NIC) applications • Integrated 10/100/1000BASE-T transceiver • 10/100/1000BASE-T triple-speed MAC • High-speed RISC core with 24-KB cache • SMBus 2.0 controller • On-chip voltage regulation • Wake-on-LAN power switching circuit • PCI Express host interface • 1x lane • 4-pin interface • Functionality identical to PCI • Performance features • TCP, IP, and UDP checksum • Microsoft® Large Send Offload • Large burst read • Interrupt coalescing • Robust Wake on LAN (WoL) • Standards-compliant WoL • Innovative out-of-box mode WoL • Hardware power switching • Comprehensive diagnostic and configuration software suite • Industry-compliant alerting features • Alert Standard Format (ASF) 2.0 support • Secure power-on and power-off • Fast hardware authentication (SHA-1, HMAC, MD5) • True hardware random number generation • Integrated TPM functionality • Secure key management • Strong authentication capabilities • Platform state verification • 3.3V I/Os (5V tolerant) • JTAG
Features
- 1. Integrated 10/100/1000BASE-T Gigabit Ethernet transceiver.
- 2. Supports PCI Express interface.
- 3. Advanced power management capabilities, including Wake-on-LAN.
- 4. Flexible packet buffer management for enhanced performance.
- 5. Supports IEEE 802.3az Energy Efficient Ethernet standard.
- 6. Integrated PHY for reduced external component count.
Application
- 1. Desktop and laptop computers.
- 2. Server systems.
- 3. Network switches and routers.
- 4. Consumer electronics devices with network connectivity.
- 5. Industrial automation and control systems.
Specifications
Parameter | Value | Parameter | Value |
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Manufacturer | BROADCOM |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BCM5755KFBG is a network interface controller (NIC) chip manufactured by Broadcom. It is commonly used in computer systems to provide Ethernet connectivity. The chip supports various networking protocols and has enhanced features like hardware acceleration, advanced power management, and integrated security mechanisms. It offers reliable and high-performance networking capabilities for both home and enterprise environments.
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Equivalent
Some equivalent products of the BCM5755KFBG chip include Broadcom BCM5751KFBG, BCM5754KFBG, and BCM5756KFBG. These chips are all Ethernet controllers commonly used in networking applications. -
Features
The BCM5755KFBG is a network interface controller (NIC) designed by Broadcom. It features gigabit Ethernet connectivity with integrated hardware acceleration for TCP/IP and iSCSI protocols. It supports advanced power management and Wake-on-LAN functionality, making it suitable for various networking applications. -
Pinout
The BCM5755KFBG is a 196-pin BGA package with a Gigabit Ethernet controller. It offers high-performance networking and supports features like TCP/IP acceleration and PCI Express interface. The pin count refers to the number of external pins on the package for connection to other components in a circuit. -
Manufacturer
The manufacturer of the BCM5755KFBG is Broadcom. Broadcom Corporation is a global semiconductor company that designs, develops, and supplies a wide range of integrated circuits and system-on-a-chip solutions. It specializes in networking and broadband communication technologies, including wired and wireless devices. -
Application Field
The BCM5755KFBG is a Broadcom network interface card commonly used in computer systems and servers. It is primarily used in enterprise applications, data centers, and cloud computing environments to provide high-speed Ethernet connectivity and reliable network performance. -
Package
The BCM5755KFBG chip is housed in a BGA (Ball Grid Array) package type, which means it has solder balls on the bottom. Its form factor is LGA (Land Grid Array), and it measures approximately 21mm x 21mm in size.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products