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BROADCOM BCM53115MIPBG
Micro Peripheral IC,
Brands: BROADCOM
Mfr.Part #: BCM53115MIPBG
Datasheet: BCM53115MIPBG Datasheet (PDF)
Package/Case: BGA
RoHS Status:
Stock Condition: 3041 pcs, New Original
Product Type: Misc Communication
Warranty: 1 Year Ovaga Warranty - Find Out More
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1
*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $84.257 | $84.257 |
| 200 | $32.608 | $6521.600 |
| 420 | $31.460 | $13213.200 |
| 840 | $30.895 | $25951.800 |
In Stock:3041 PCS
BCM53115MIPBG General Description
5-PORT 10/100 SWITCH WITH ON-CHIP PACKET BUFFERThe Broadcom BCM5315 device is a highly integrated solution. It combines all the functions of a high-speed switch system–including packet buffer, PHY transceivers, media access controllers, address management and a non-blocking switch fabric–into a single 0.22µ CMOS device. It complies with the IEEE 802.3, 802.3µ and 802.3x specifications, including the MAC control PAUSE frame and auto-negotiation subsections, providing compatibility with all industry-standard Ethernet and Fast Ethernet devices.BCM5315 FEATURES• The highest level of silicon integration achieved for a 5-port 10/100 Ethernet switch device• The world’s first single-chip switch• The BCM5315 integrates: • Five transceivers (802.3u compliant) • Six media access controllers (802.x compliant) • 256 KB packet buffer • Non-blocking switch fabric• Non-blocking switch fabric through a 2.6-Gbps expansion port, cascading up to three devices• MII interface supports an additional 100FX or 100TX connection enabling a sixth user port• Supports up to 4K MAC addresses• Flow control: full-duplex (802.3x) and half-duplex options supported• Supports automatic address learning and aging• Typical power consumption: <2.2W• 208-pin PQFP package• Optional management features: • Low-cost MIB AutocastTM function • Hardware support for Simple Network Management Protocol (SNMP), Remote Network Monitoring (RMON) and Spanning Tree
Features
- The features of BCM53115MIPBG include support for five integrated GPHYs
- two additional IMP ports
- CFP support
- BroadSync™ HD
- SmartPATH™ software support
- FASTPATH® software support
- RoHS support
- cable diagnostics tool support
- LoopDTech tool support
- flexible LED scheme support
- and target applications in CPE/Gateway
- WLAN router
- and Smart switch
Application
- The applications of BCM53115MIPBG include CPE/Gateway
- WLAN router
- and Smart switch in the consumer market segment
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Mfr | Broadcom Limited | Series | * |
| Package | Tray | Product Status | Obsolete |
| Base Product Number | BCM53115 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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BCM53115MIPBG is a highly integrated Ethernet switch chip designed for use in small and medium-sized business networks. With its advanced features, such as VLAN support, quality of service management, and security features, it provides reliable and efficient network connectivity. The chip supports multiple Gigabit Ethernet ports, making it suitable for building scalable and high-performance networks.
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Equivalent
Some equivalent products of the BCM53115MIPBG chip include the KSZ9563R and KSZ9564R from Microchip Technology, the RTL8367 from Realtek Semiconductor, and the VSC8662XIC-01 from Microsemi. These chips are all multi-port Ethernet switches designed for use in networking applications. -
Features
BCM53115MIPBG is a Gigabit Ethernet switch system-on-a-chip (SoC) by Broadcom. Its features include five integrated Gigabit Ethernet transceivers, support for VLANs, QoS, and port mirroring, and IPv6 readiness. It is designed for use in small and medium-sized business switches and offers high performance, low power consumption, and advanced network management capabilities. -
Pinout
The BCM53115MIPBG is a 100-pin Ethernet switch IC. It is designed to provide high-performance switching for small and medium-sized businesses and enterprise applications. It offers various functions such as support for multiple Ethernet protocols, VLAN, QoS, and energy-efficient Ethernet. -
Manufacturer
The manufacturer of the BCM53115MIPBG is Broadcom Inc. Broadcom is an American multinational semiconductor company that specializes in designing and manufacturing a wide range of communication chips and systems. -
Application Field
The BCM53115MIPBG is a switch chip developed by Broadcom. It is commonly used in enterprise and carrier Ethernet access equipment, such as routers, switches, gateways, and access points. Its application areas include data centers, telecommunications, industrial automation, smart cities, and internet of things (IoT) devices. -
Package
The BCM53115MIPBG chip is available in a 208-pin PBGA package type. It has a form factor of 15mm x 15mm and a size of 208 pins.
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