88AP270MA2-BHE1C312
M180 (Bulverde TSMC) A2 23mm PBGA RoHS 6/6 SAC405 312MHz
Brands: MARVELL SEMICONDUCTOR INC
Mfr.Part #: 88AP270MA2-BHE1C312
Datasheet: 88AP270MA2-BHE1C312 Datasheet (PDF)
Package/Case: BGA-356
RoHS Status:
Stock Condition: 6554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomFeatures
- Constant ON-Resistance for Signals to ±10V (DG182, DG185, DG188, DG191), to ±7.5V (All Devices)
- ±15V Power Supplies
- <2nA Leakage from Signal Channel in Both ON and OFF States
- TTL, DTL, RTL Direct Drive Compatibility
- tON, tOFF <150ns, Break-Before-Make Action
- Cross-Talk and Open Switch Isolation>50dB at 10MHz (75Ω Load)
Specifications
Parameter | Value | Parameter | Value |
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Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | MARVELL SEMICONDUCTOR INC |
Part Package Code | BGA | Package Description | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-360 |
Pin Count | 360 | Reach Compliance Code | compliant |
HTS Code | 8542.31.00.01 | JESD-609 Code | e1 |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -25 °C |
Package Body Material | PLASTIC/EPOXY | Package Shape | SQUARE |
Power Supplies | 1.8/3.3 V | Qualification Status | Not Qualified |
Supply Voltage-Max | 3.3 V | Supply Voltage-Min | 1.8 V |
Surface Mount | YES | Technology | CMOS |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Position | BOTTOM |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The 88AP270MA2-BHE1C312 chip is an integrated circuit designed for high-performance computing applications. It offers advanced features such as multi-core processing, high-speed connectivity, and power efficiency. The chip can be used in a wide range of devices, including smartphones, tablets, and smart appliances. Its compact size and low power consumption make it an ideal choice for next-generation electronic devices.
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Features
The features of 88AP270MA2-BHE1C312 are: ARM Cortex-A9 processor, PowerVR SGX540 GPU, video encoding up to 1080p30, HDMI output, dual-panel display, touchscreen support, USB and Ethernet connectivity, and compatibility with various operating systems. -
Manufacturer
The manufacturer of the 88AP270MA2-BHE1C312 is NXP Semiconductors. NXP Semiconductors is a leading global semiconductor company that provides high-performance mixed-signal and standard product solutions used in a wide range of applications, including automotive, industrial, Internet of Things (IoT), mobile devices, and communication infrastructure. -
Application Field
The 88AP270MA2-BHE1C312 is a system-on-chip designed for automotive applications. It is suitable for instrument clusters, heads-up displays, infotainment systems, and other automotive displays.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products