Intel 5M1270ZF256I5N
CPLD - Complex Programmable Logic Devices CPLD - MAX V 980 Macro 211 IOs
Brands: Intel
Mfr.Part #: 5M1270ZF256I5N
Datasheet: 5M1270ZF256I5N Datasheet (PDF)
Package/Case: FBGA-256
Product Type: CPLD - Complex Programmable Logic Devices
RoHS Status:
Stock Condition: 9458 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomFeatures
- The features of 5M1270ZF256I5N are not explicitly mentioned in the provided search results
Application
- The applications of 5M1270ZF256I5N include JTAG and In-System Programmability in MAX V Devices
- boundary-scan testing
- and IEEE Std
- 1149
- 1 BST operation control
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer: | Intel | Product Category: | CPLD - Complex Programmable Logic Devices |
RoHS: | Details | Series: | 5M1270Z |
Mounting Style: | SMD/SMT | Package / Case: | FBGA-256 |
Operating Supply Voltage: | 1.8 V | Number of Macrocells: | 980 |
Number of I/Os: | 211 I/O | Supply Voltage - Max: | 1.89 V |
Supply Voltage - Min: | 1.71 V | Minimum Operating Temperature: | - 40 C |
Maximum Operating Temperature: | + 85 C | Maximum Operating Frequency: | 304 MHz |
Propagation Delay - Max: | 6.2 ns | Packaging: | Tray |
Brand: | Intel / Altera | Memory Type: | Flash |
Moisture Sensitive: | Yes | Number of Logic Array Blocks - LABs: | 127 |
Number of Logic Elements: | 1270 | Operating Supply Current: | 2 mA |
Product Type: | CPLD - Complex Programmable Logic Devices | Factory Pack Quantity: | 90 |
Subcategory: | Programmable Logic ICs | Total Memory: | 8192 bit |
Tradename: | MAX V | Part # Aliases: | 968257 |
Unit Weight: | 1.534644 oz |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The 5M1270ZF256I5N chip is a high-performance microcontroller unit (MCU) manufactured by a specific company. It is designed for various applications that require advanced computing capabilities. The chip incorporates a 256KB flash memory, offering efficient and reliable data storage. With its 5M1 series, it provides enhanced features and functionalities for embedded systems, making it an excellent choice for developers and engineers.
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Pinout
The 5M1270ZF256I5N has 256 pins and is a Field-Programmable Gate Array (FPGA) integrated circuit. FPGAs are reconfigurable logic devices used in a variety of applications, allowing for customizable digital circuits. -
Application Field
The 5M1270ZF256I5N is a high-performance FPGA (Field-Programmable Gate Array) suitable for a wide range of applications such as high-speed networking, telecommunications, aerospace, defense, and high-performance computing. It can be used in designs that require advanced processing, data acceleration, and complex system integration. -
Package
The 5M1270ZF256I5N chip is packaged in a Ball Grid Array (BGA) package type. Its form is integrated with a mixture of surface mount and through-hole components. The size of the chip is specified as 256 in its part number, indicating the number of pins or connections.
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