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Intel 10M40DAF256I7G

MAX® 10 Field Programmable Gate Array (FPGA) IC 178 1290240 40000 256-LBGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: 10M40DAF256I7G

Datasheet: 10M40DAF256I7G Datasheet (PDF)

Package/Case: 256-LBGA

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 2,943 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for 10M40DAF256I7G or email to us: Email: [email protected], we will contact you within 12 hours.

10M40DAF256I7G General Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 178 1290240 40000 256-LBGA

Intel Corp Inventory

Specifications

Parameter Value Parameter Value
Case/Package FBGA Mount Surface Mount
Number of Pins 256 Max Operating Temperature 100 °C
Min Operating Temperature -40 °C Number of I/Os 178
Number of Logic Blocks (LABs) 2500 Number of Logic Elements/Cells 40000
RAM Size 157.5 kB

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The 10M40DAF256I7G chip is a high-performance field-programmable gate array (FPGA) manufactured by Intel. It offers 40,000 logic elements and is part of the Intel MAX 10 family of FPGAs. The chip features advanced embedded memory, digital signal processing (DSP) blocks, and transceivers. It is suitable for a wide range of applications including industrial automation, communications, and automotive systems.
  • Features

    The 10M40DAF256I7G is a microcontroller with a maximum operating frequency of 500MHz. It has 10,000 logic elements, 414 programmable logic blocks, and 167 global clock networks. It also features 256 kbits of embedded memory, various I/O interfaces, and is available in a 256-pin package.
  • Pinout

    The pin count of the 10M40DAF256I7G is 256. It is a field-programmable gate array (FPGA) with a function of digital logic and programmable interconnect.
  • Manufacturer

    The manufacturer of the 10M40DAF256I7G is Intel Corporation. Intel is an American multinational technology company known for manufacturing computer processors, semiconductor chips, and other computing-related products.
  • Application Field

    The 10M40DAF256I7G is a high-performance field-programmable gate array (FPGA) that can be used in various application areas such as telecommunications, networking, industrial automation, automotive, aerospace, and defense. Its versatile capabilities allow for the implementation of complex digital circuits and advanced signal processing algorithms.
  • Package

    The 10M40DAF256I7G chip has a package type of FBGA, form factor of 256-BGA, and a size of 17mm x 17mm.

Datasheet PDF

Preliminary Specification 10M40DAF256I7G PDF Download

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