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Xilinx XC3S1400A-4FGG676C
FPGA - Field Programmable Gate Array XC3S1400A-4FGG676C
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S1400A-4FGG676C
Datasheet: XC3S1400A-4FGG676C Datasheet (PDF)
Package/Case: BGA-676
RoHS Status:
Stock Condition: 3707 pcs, New Original
Product Type: Programmable Logic ICs
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $585.841 | $585.841 |
| 200 | $233.756 | $46751.200 |
| 480 | $225.944 | $108453.120 |
| 1000 | $222.084 | $222084.000 |
In Stock:3707 PCS
XC3S1400A-4FGG676C General Description
FPGA, SPARTAN-3A, 1400K ELE, 676FBGA; Programmable Logic Type:FPGA; Logic IC Function:FPGA; Logic IC Base Number:3S1400; No of I/O Lines:502; No. of Macrocells:25344; Frequency:250MHz; I/O Interface Standard:LVTTL, LVCMOS, PCI, HSTL, SSTL; Voltage, Supply Min:1.14V; Voltage, Supply Max:1.26V; Case Style:FBGA; Operating Temperature Range:0°C to +85°C; No. of Pins:676; Termination Type:SMD
Features
- 1400K System Gates
- 88Kb Block RAM
- 2.1Mbits Distributed RAM
- 592 User I/O
- 356 I/O Pins
- 500MHz Maximum Operating Frequency
Application
- XC3S1000-4FGG676C
- XC3S1500-4FGG676C
- XC3S2000-4FGG676C
- XC3S2500-4FGG676C
- XC3S4000-4FGG676C
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FBGA | Mount | Surface Mount |
| Number of Pins | 676 | Frequency | 250 MHz |
| Max Operating Temperature | 85 °C | Max Supply Voltage | 1.26 V |
| Min Operating Temperature | 0 °C | Min Supply Voltage | 1.14 V |
| Number of Gates | 1.4e+06 | Number of I/Os | 502 |
| Number of Logic Blocks (LABs) | 2816 | Number of Logic Elements/Cells | 25344 |
| Number of Macrocells | 25344 | Operating Supply Voltage | 1.2 V |
| RAM Size | 72 kB | Speed Grade | 4 |
| Termination | SMD/SMT |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S1400A-4FGG676C is a programmable logic chip manufactured by Xilinx. It belongs to the Spartan-3A FPGA family and comes in a 676-pin BGA package. The chip features 1400 slices, 50,592 logic cells, and 18 multipliers. It provides a flexible and reconfigurable solution for digital system designs, allowing developers to implement various functions and algorithms in hardware.
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Equivalent
Equivalent products of the XC3S1400A-4FGG676C chip include the XC3S1400A-4FGG320C, XC3S1400A-5FGG320C, and the XC3S1400A-4FGG484C. These products have similar features and specifications but may have slight differences in package type or performance. -
Features
The XC3S1400A-4FGG676C is an FPGA (Field Programmable Gate Array) from Xilinx. It has 1,408 slices, 68 I/O pins, and a 4-input lookup table. It operates at a speed grade of -4 and comes in a 676-ball fine pitch ball grid array package. -
Pinout
The XC3S1400A-4FGG676C has a pin count of 676 and is a field-programmable gate array (FPGA) device. It is part of the Spartan-3A family and offers 1400 slices of varying functions such as logic function, memory, arithmetic function, and more. -
Manufacturer
The manufacturer of the XC3S1400A-4FGG676C is Xilinx. Xilinx is an American technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs). -
Application Field
The XC3S1400A-4FGG676C is a field-programmable gate array (FPGA) device. It is commonly used in various applications including communications, networking, industrial automation, automotive electronics, and aerospace. It provides high-performance, low-power, and flexible programmability, making it suitable for a wide range of applications in these areas. -
Package
The XC3S1400A-4FGG676C chip has a 676-pin Fine pitch Ball Grid Array (FBGA) package type. It has a form factor of 27mm x 27mm and a size of 676 pins.
Datasheet PDF
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