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Xilinx XC2C256-7FTG256C
FTBGA-256 Programmable Logic Device (CPLDs/FPGAs) ROHS
Brands: AMD Xilinx, Inc
Mfr.Part #: XC2C256-7FTG256C
Datasheet: XC2C256-7FTG256C Datasheet (PDF)
Package/Case: 256-FTBGA
Product Type: Programmable Logic ICs
XC2C256-7FTG256C General Description
IC CPLD 256MC 6.7NS 256BGAIC CPLD 256MC 6.7NS 256BGA
Features
- The features of XC2C256-7FTG256C include:
- - Macrocells: 256
- - Max I/O: 184
- - TPD (ns): 5
- 7
- - TSU (ns): 2
- 4
- - TCO (ns): 4
- 5
- - FSYSTEM1 (MHz): 256
Application
- The XC2C256-7FTG256C CoolRunner-II CPLD has various applications such as in high-speed and portable markets
- supporting hot plugging
- tolerating different power sequences
- and allowing for on-the-fly programming
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 256 | Package Category | BGA |
| Released Date | Mar 11, 2020 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC2C256-7FTG256C is a field-programmable gate array (FPGA) chip. It belongs to the CoolRunner-II family of devices developed by Xilinx. With 256 macrocells and 256 I/O pins, it allows for the implementation of complex digital circuits. The 7FTG256C variant operates with 7ns maximum propagation delay and is suitable for applications that require high-speed processing.
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Equivalent
Equivalent products of XC2C256-7FTG256C chip include XC2C256-7VQG100C, XC2C256-7PQG208C, and XC2C256-7TQG144C. -
Features
Some features of XC2C256-7FTG256C include a capacity of 256 macrocells, 85 input/output pins, programmable logic blocks, on-chip SRAM, and built-in configuration memory. It operates at a voltage of 1.2V to 3.3V and offers easy programming and reconfiguration for a wide range of applications. -
Pinout
The XC2C256-7FTG256C is a field-programmable gate array (FPGA) with a pin count of 256. It has various functions, including digital logic processing, configuration memory storage, and I/O interfaces. -
Manufacturer
The manufacturer of the XC2C256-7FTG256C is Xilinx Inc. It is a multinational technology company specializing in the development and production of programmable logic devices, system-on-chips, and other integrated circuits. -
Application Field
The XC2C256-7FTG256C is a field-programmable gate array (FPGA) that can be used in various application areas such as industrial automation, telecommunications, automotive, aerospace, and defense. It provides flexible and customizable solutions for tasks like data processing, signal processing, control systems, and more. -
Package
The XC2C256-7FTG256C chip comes in a Fine-pitch BGA (Ball Grid Array) package type with a 256-ball grid array, or grid of solder balls, for mounting on a circuit board. Its form factor is a 17x17 mm square, making it a relatively compact chip size.
Datasheet PDF
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