TI TMS320VC5510AGGWA2
BGA-240 Digital Signal Processors / Controllers (DSPs/DSCs) ROHS TMS320VC5510AGGWA2
Brands: Texas Instruments
Mfr.Part #: TMS320VC5510AGGWA2
Datasheet: TMS320VC5510AGGWA2 Datasheet (PDF)
Package/Case: BGA-240 Microstar
RoHS Status:
Stock Condition: 6554 pcs, New Original
Product Type: Digital Signal Processors & Controllers - DSP, DSC
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $63.536 | $63.536 |
200 | $24.590 | $4918.000 |
500 | $23.725 | $11862.500 |
1000 | $23.297 | $23297.000 |
In Stock:6554 PCS
TMS320VC5510AGGWA2 General Description
The TMS320VC5510AGGWA2 is a digital signal processor (DSP) produced by Texas Instruments. It features a low-power, fixed-point DSP core running at up to 100MHz, making it ideal for applications requiring real-time signal processing. The processor has 16-bit fixed-point arithmetic and a parallel architecture that allows for efficient processing of multiple data streams.The TMS320VC5510AGGWA2 also includes integrated peripherals such as a direct memory access (DMA) controller, serial ports, and a pulse-width modulation (PWM) unit for easy interfacing with external devices. It has 32KB of on-chip RAM and 128KB of on-chip Flash memory for program storage.This DSP is commonly used in audio processing, telecommunications, and industrial control applications. It offers high performance while consuming minimal power, making it suitable for portable and battery-powered devices. The TMS320VC5510AGGWA2 is available in a small-form-factor BGA package, making it easy to integrate into compact designs
Features
Application
Specifications
Parameter | Value | Parameter | Value |
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Product Category | Digital Signal Processors & Controllers - DSP, DSC | RoHS | N |
Product | DSPs | Series | TMS320VC5510A |
Mounting Style | SMD/SMT | Package / Case | BGA-240 Microstar |
Core | C55x | Maximum Clock Frequency | 200 MHz |
Program Memory Size | 32 kB | Data RAM Size | 320 kB |
Operating Supply Voltage | 1.6 V | Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 85 C | Brand | Texas Instruments |
Data Bus Width | 32 bit | Data ROM Size | 32 kB |
Instruction Type | Fixed Point | Moisture Sensitive | Yes |
Number of I/Os | 8 I/O | Product Type | DSP - Digital Signal Processors & Controllers |
Program Memory Type | Asynchronous SRAM, EPROM, Synchronous SDRAM, SBSRAM | Factory Pack Quantity | 126 |
Subcategory | Embedded Processors & Controllers |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The TMS320VC5510AGGWA2 chip is a digital signal processor (DSP) from Texas Instruments. It is designed for digital audio applications and features a 16-bit fixed-point DSP core running at up to 100 MHz. This chip also includes peripherals such as a USB interface, serial ports, and programmable timers for versatile functionality in audio processing applications.
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Equivalent
Some equivalent products of the TMS320VC5510AGGWA2 chip are the TMS320VC5509AGGGR and TMS320VC5509AZZUR chips. These chips are part of the TMS320C55x fixed-point digital signal processor family and offer similar features and performance to the TMS320VC5510AGGWA2 chip. -
Features
Some features of TMS320VC5510AGGWA2 include a 16-bit fixed-point DSP core, up to 100 MIPS performance, a 16-bit external memory interface, on-chip 8K × 16-bit OTP ROM, up to 32K × 16-bit internal ROM, and more efficient code size. It is ideal for applications such as digital audio, telecommunication systems, and more. -
Pinout
The TMS320VC5510AGGWA2 is a digital signal processor with a pin count of 144. Its functions include audio and voice processing, control applications, and communications systems. It features a 16-bit fixed-point processor core, 16 KB of on-chip RAM, and multiple communication interfaces for data transfer. -
Manufacturer
The manufacturer of the TMS320VC5510AGGWA2 is Texas Instruments. Texas Instruments is a multinational technology company that designs and manufactures semiconductors and various electronics products. They are well-known for their wide range of analog and digital processors, microcontrollers, and sensors used in a variety of applications including communications, automotive, and industrial sectors. -
Application Field
The TMS320VC5510AGGWA2 is commonly used in applications requiring low-power real-time processing, such as portable audio devices, digital televisions, and wireless communication systems. It is also utilized in industrial control systems, medical devices, and automotive systems that benefit from its high performance and low power consumption capabilities. -
Package
The TMS320VC5510AGGWA2 chip comes in a BGA (Ball Grid Array) package, with a form factor of 144-ball, 9-mm x 9-mm ceramic BGA package. The size of the chip is 7mm x 7mm.
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