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Orders Over
$5000TMPN3150B1AFG
IC 1 CHANNEL(S), LOCAL AREA NETWORK CONTROLLER
Brands: Toshiba America Electronic Components
Mfr.Part #: TMPN3150B1AFG
Datasheet: TMPN3150B1AFG Datasheet (PDF)
Package/Case: QFP-64
RoHS Status:
Stock Condition: 6,554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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TMPN3150B1AFG General Description
TMPN3150B1AFG is a microprocessor manufactured by Toshiba. It belongs to the TMPN3150 series of embedded microcontrollers designed for automotive applications. This particular model features an ARM Cortex-M3 core running at speeds up to 80 MHz, providing high performance for real-time control tasks. It has a variety of peripheral interfaces including CAN, LIN, UART, SPI, and I2C, making it suitable for communication in automotive systems. The microprocessor also offers a rich set of on-chip features such as timers, PWM channels, analog-to-digital converters, and watchdog timers, enabling efficient system integration and control. With its automotive-grade reliability and robustness, TMPN3150B1AFG is widely used in automotive control systems for applications such as engine control, powertrain management, and chassis control
Features
- Low-power, high-performance 32-bit ARM Cortex-M3 processor
- Operating frequency up to 50MHz
- 512KB flash memory and 64KB SRAM
- Integrated 1.8V regulator for internal core voltage
- Multiple power modes for optimizing power consumption
- Rich set of peripherals including UART, SPI, I2C, and ADC
Application
- Industrial automation
- Robotics
- Consumer electronics
- Remote control systems
- Wireless communication devices
- Home automation
- Security systems
- Internet of Things (IoT) devices
- Automotive applications
- Sensor networks
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Source Content uid | TMPN3150B1AFG | Rohs Code | Yes |
| Part Life Cycle Code | Obsolete | Ihs Manufacturer | TOSHIBA CORP |
| Part Package Code | QFP | Package Description | 14 X 14 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, QFP-64 |
| Pin Count | 64 | Address Bus Width | 16 |
| Boundary Scan | NO | Clock Frequency-Max | 10 MHz |
| External Data Bus Width | 8 | JESD-30 Code | S-PQFP-G64 |
| Length | 14 mm | Low Power Mode | YES |
| Number of Serial I/Os | 1 | Number of Terminals | 64 |
| Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
| Package Body Material | PLASTIC/EPOXY | Package Code | QFP |
| Package Shape | SQUARE | Package Style | FLATPACK |
| Qualification Status | Not Qualified | Seated Height-Max | 3.15 mm |
| Supply Voltage-Max | 5.5 V | Supply Voltage-Min | 4.5 V |
| Supply Voltage-Nom | 5 V | Surface Mount | YES |
| Technology | CMOS | Temperature Grade | INDUSTRIAL |
| Terminal Form | GULL WING | Terminal Pitch | 0.8 mm |
| Terminal Position | QUAD | Width | 14 mm |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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![Product]( "Product")
Step1 :Product
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![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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TMPN3150B1AFG is a chip developed by Toshiba with integrated circuits for digital signal processing and image compression. It is designed specifically for applications in industrial image processing, security systems, and network cameras. The chip offers high-speed image processing capabilities, low power consumption, and advanced compression algorithms, making it suitable for various imaging applications.
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Equivalent
There are no direct equivalent products to the TMPN3150B1AFG chip. However, similar chips in the same family include TMPN3150B1AF, TMPN3150BXAFG, and TMPN3150BXAF. It is important to note that the specific requirements and features of the application should be taken into consideration while selecting an alternative chip. -
Features
The TMPN3150B1AFG is a System-on-Chip (SoC) designed by Toshiba. It features a high-performance ARM Cortex-A9 quad-core processor, clocked at 1.3 GHz, with integrated graphics capabilities. It is designed for use in applications such as automotive infotainment systems, industrial automation, and smart appliances. -
Pinout
The TMPN3150B1AFG is a microcontroller by Toshiba. It has 100 pins and is used for various applications, such as home appliances and industrial equipment. -
Manufacturer
The manufacturer of the TMPN3150B1AFG is Toshiba Corporation. Toshiba Corporation is a Japanese multinational conglomerate company that specializes in various products and services, including information technology, consumer electronics, and energy systems. -
Application Field
The TMPN3150B1AFG is a System-on-Chip (SoC) designed for use in digital signage applications. It offers advanced multimedia processing capabilities, including support for 4K Ultra HD video playback, audio decoding, and networking. This makes it suitable for applications such as advertising displays, information kiosks, and video walls in various public environments. -
Package
The TMPN3150B1AFG chip has a BGA package type (Ball Grid Array), it has a 272-ball form, and its size is approximately 13mm x 13mm.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
