Infineon TLE5012BE1000

Part points

• The TLE5012BE1000 is a magnetic sensor chip that provides position measurement with high accuracy and resolution. It is commonly used in automotive and industrial applications for detecting the angle of rotating objects. The chip utilizes Hall sensor technology and a robust interface for reliable performance.

• Equivalent

  Some equivalent products of the TLE5012BE1000 chip include the MLX90393, HMC5983, and AS5600. These chips offer similar functionalities such as rotary position sensing, magnetic field measurement, and analog output. They can be used as alternatives in various applications where precise and accurate position sensing is required.

• Features

  TLE5012BE1000 is a 360° angle sensor with a system-on-chip architecture, providing accurate and reliable angle measurements for automotive and industrial applications. It offers high resolution, immunity to stray magnetic fields, robustness to harsh environments, and low power consumption.

• Pinout

  The TLE5012BE1000 has 8 pins and is a programmable angle sensor with a resolution of 0.09° and a range of 360°. It provides sine and cosine signals for angle measurement and features integrated Hall sensors for precise measurement.

• Manufacturer

  The TLE5012BE1000 is manufactured by Infineon Technologies, a German semiconductor company specializing in automotive, industrial, and chip card security solutions. Infineon is a leading provider of power semiconductors, microcontrollers, sensors, and integrated circuits for various industries, including automotive, industrial, and consumer electronics.

• Application Field

  The TLE5012BE1000 is commonly used in automotive applications for angle sensing in electric power steering systems, throttle position sensors, and brake-by-wire systems. It can also be used in industrial automation for position feedback in robotics, encoders, and actuators. The sensor offers high accuracy and high resolution for precise angle measurement.

• Package

  The TLE5012BE1000 chip comes in a SOIC package. It is in the form of a surface-mount technology component. The size of the chip is 8-pin with dimensions of 4.9x3.9 mm.