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SDINBDG4-8G-XI1
eMMC 8GB iNAND 7250 Ind. eMMC 5.1 -40C to 85C
Brands: WESTERN DIGITAL CORP
Mfr.Part #: SDINBDG4-8G-XI1
Datasheet: SDINBDG4-8G-XI1 Datasheet (PDF)
Package/Case: BGA153
Product Type: eMMC
SDINBDG4-8G-XI1 General Description
The SDINBDG4-8G-XI1 is not a known digital integrated circuit or a specific electronic component. It does not have a defined definition or commonly known features and applications.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Name | SDINBDG4-8G-XI1 | Product Type | NAND Flash |
| Manufacturer | SanDisk | Memory Size | 8GB |
| Interface | SDR (Single Data Rate) | Operating Voltage | 2.7V - 3.6V |
| Operating Temperature Range | -40°C to 85°C | Package/Case | 153 Ball FBGA |
| Dimensions | 14mm x 18mm x 1.2mm | Rohs Code | Yes |
| Part Life Cycle Code | Active | Ihs Manufacturer | WESTERN DIGITAL CORP |
| Package Description | , | Reach Compliance Code | |
| ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
| Factory Lead Time | 53 Weeks, 1 Day | Clock Frequency-Max (fCLK) | 200 MHz |
| Data Retention Time-Min | 1 | Endurance | 3000 Write/Erase Cycles |
| JESD-30 Code | R-PBGA-B153 | Length | 13 mm |
| Memory Density | 68719476736 bit | Memory IC Type | FLASH CARD |
| Memory Width | 8 | Number of Functions | 1 |
| Number of Terminals | 153 | Number of Words | 8589934592 words |
| Number of Words Code | 8000000000 | Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
| Organization | 8GX8 | Package Body Material | PLASTIC/EPOXY |
| Package Code | VFBGA | Package Equivalence Code | BGA153,14X14,20 |
| Package Shape | RECTANGULAR | Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL | Programming Voltage | 3.3 V |
| Seated Height-Max | 0.8 mm | Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 2.7 V | Supply Voltage-Nom (Vsup) | 3.3 V |
| Surface Mount | YES | Technology | CMOS |
| Terminal Finish | TIN SILVER COPPER NICKEL GERMANIUM | Terminal Form | BALL |
| Terminal Pitch | 0.5 mm | Terminal Position | BOTTOM |
| Type | MLC NAND TYPE |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The SDINBDG4-8G-XI1 chip is a memory product manufactured by SanDisk. It is an 8GB NAND flash storage solution, designed for use in mobile devices and other electronic applications. This chip offers fast and reliable data storage capabilities, allowing for efficient data transfer and retrieval.
-
Features
SDINBDG4-8G-XI1 is a memory card featuring an 8GB storage capacity with a compact design suitable for small devices requiring high storage. It offers enhanced data transfer speeds, reliability, and durability. The card is compatible with a wide range of devices, making it ideal for various applications. -
Manufacturer
The manufacturer of the SDINBDG4-8G-XI1 is SanDisk. SanDisk is a company that specializes in the development and production of flash memory storage solutions. -
Application Field
The SDINBDG4-8G-XI1 is primarily used in applications such as automotive, industrial, and consumer electronics. It is suitable for applications that require high-speed data transfer and reliable storage, including automotive infotainment systems, industrial control equipment, and portable consumer devices. -
Package
The SDINBDG4-8G-XI1 chip has a BGA package type, a 153-ball form, and a size of 11.5mm x 13mm.
Key points
-
The SDINBDG4-8G-XI1 chip is a memory product manufactured by SanDisk. It is an 8GB NAND flash storage solution, designed for use in mobile devices and other electronic applications. This chip offers fast and reliable data storage capabilities, allowing for efficient data transfer and retrieval.
-
Features
SDINBDG4-8G-XI1 is a memory card featuring an 8GB storage capacity with a compact design suitable for small devices requiring high storage. It offers enhanced data transfer speeds, reliability, and durability. The card is compatible with a wide range of devices, making it ideal for various applications. -
Manufacturer
The manufacturer of the SDINBDG4-8G-XI1 is SanDisk. SanDisk is a company that specializes in the development and production of flash memory storage solutions. -
Application Field
The SDINBDG4-8G-XI1 is primarily used in applications such as automotive, industrial, and consumer electronics. It is suitable for applications that require high-speed data transfer and reliable storage, including automotive infotainment systems, industrial control equipment, and portable consumer devices. -
Package
The SDINBDG4-8G-XI1 chip has a BGA package type, a 153-ball form, and a size of 11.5mm x 13mm.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
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