Infineon S70GL02GS11FHI010
NOR Flash Parallel 3V/3.3V 2G-bit 128M x 16 110ns 64-Pin Fortified BGA Tray
Brands: Infineon Technologies Corporation
Mfr.Part #: S70GL02GS11FHI010
Datasheet: S70GL02GS11FHI010 Datasheet (PDF)
Package/Case: BGA-64
Product Type: Memory
RoHS Status:
Stock Condition: 3315 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomS70GL02GS11FHI010 General Description
FLASH - NOR Memory IC 2Gbit Parallel 110 ns 64-FBGA (13x11)
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
RHoS | yes | PBFree | yes |
HalogenFree | no | feature-organization | |
feature-minimum-operating-supply-voltage-v | 2.7 | feature-maximum-access-time-ns | 110 |
feature-process-technology | 65nm, MirrorBit | feature-maximum-operating-supply-voltage-v | 3.6 |
feature-maximum-operating-current-ma | 60 | feature-packaging | Tray |
feature-rad-hard | feature-pin-count | 64 | |
feature-supplier-package | Fortified BGA | feature-standard-package-name1 | BGA |
feature-cecc-qualified | No | feature-esd-protection | |
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | 3A991.b.1.a |
feature-svhc | No |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The S70GL02GS11FHI010 chip is a flash memory device manufactured by Spansion. It has a capacity of 2 gigabits and operates at a supply voltage of 2.7 to 3.6 volts. This chip is designed for use in various applications such as automotive, networking, and consumer electronics. It offers high-performance read and program/erase operations, making it suitable for storing data and code in a range of devices.
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Equivalent
There are several equivalent products to the S70GL02GS11FHI010 chip, including the S29GL02GS11FHI020 and the S39GL02GS11FHI010 chips. -
Features
The S70GL02GS11FHI010 is a 2Gb, 3.3V NOR flash memory chip from Cypress Semiconductor. It offers high-speed operation, a wide operating voltage range, and a small sector erase time for efficient performance. It also has a standard pinout, making it compatible with most existing designs. -
Manufacturer
The S70GL02GS11FHI010 is manufactured by Cypress Semiconductor Corp., which is a global semiconductor company that designs and manufactures a wide range of integrated circuits and memory solutions. -
Application Field
The S70GL02GS11FHI010 is a NAND Flash Memory device, commonly used in applications such as automotive, industrial, and telecommunications. It is used for storing data in these sectors due to its high capacity, fast read and write speeds, and durability in harsh environments. -
Package
The S70GL02GS11FHI010 chip has a BGA package type, a 48-ball form, and a size of 8mm x 6mm.
Datasheet PDF
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