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Infineon S70GL02GS11FHI010

NOR Flash Parallel 3V/3.3V 2G-bit 128M x 16 110ns 64-Pin Fortified BGA Tray

ISO14001 ISO9001 DUNS

Brands: Infineon Technologies Corporation

Mfr.Part #: S70GL02GS11FHI010

Datasheet: S70GL02GS11FHI010 Datasheet (PDF)

Package/Case: BGA-64

Product Type: Memory

RoHS Status:

Stock Condition: 3315 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for S70GL02GS11FHI010 or email to us: Email: [email protected], we will contact you within 12 hours.

S70GL02GS11FHI010 General Description

FLASH - NOR Memory IC 2Gbit Parallel 110 ns 64-FBGA (13x11)

Specifications

Parameter Value Parameter Value
RHoS yes PBFree yes
HalogenFree no feature-organization
feature-minimum-operating-supply-voltage-v 2.7 feature-maximum-access-time-ns 110
feature-process-technology 65nm, MirrorBit feature-maximum-operating-supply-voltage-v 3.6
feature-maximum-operating-current-ma 60 feature-packaging Tray
feature-rad-hard feature-pin-count 64
feature-supplier-package Fortified BGA feature-standard-package-name1 BGA
feature-cecc-qualified No feature-esd-protection
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991.b.1.a
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The S70GL02GS11FHI010 chip is a flash memory device manufactured by Spansion. It has a capacity of 2 gigabits and operates at a supply voltage of 2.7 to 3.6 volts. This chip is designed for use in various applications such as automotive, networking, and consumer electronics. It offers high-performance read and program/erase operations, making it suitable for storing data and code in a range of devices.
  • Equivalent

    There are several equivalent products to the S70GL02GS11FHI010 chip, including the S29GL02GS11FHI020 and the S39GL02GS11FHI010 chips.
  • Features

    The S70GL02GS11FHI010 is a 2Gb, 3.3V NOR flash memory chip from Cypress Semiconductor. It offers high-speed operation, a wide operating voltage range, and a small sector erase time for efficient performance. It also has a standard pinout, making it compatible with most existing designs.
  • Manufacturer

    The S70GL02GS11FHI010 is manufactured by Cypress Semiconductor Corp., which is a global semiconductor company that designs and manufactures a wide range of integrated circuits and memory solutions.
  • Application Field

    The S70GL02GS11FHI010 is a NAND Flash Memory device, commonly used in applications such as automotive, industrial, and telecommunications. It is used for storing data in these sectors due to its high capacity, fast read and write speeds, and durability in harsh environments.
  • Package

    The S70GL02GS11FHI010 chip has a BGA package type, a 48-ball form, and a size of 8mm x 6mm.

Datasheet PDF

Preliminary Specification S70GL02GS11FHI010 PDF Download

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  • Product

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  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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