Infineon S29GL01GS11DHIV20

Part points

• The S29GL01GS11DHIV20 is a flash memory chip manufactured by Cypress Semiconductor. It has a capacity of 1 gigabit and uses NOR flash technology. The chip is designed for storage applications in various devices such as embedded systems, automotive electronics, and consumer electronics. It offers high performance, reliability, and a wide operating temperature range, making it suitable for demanding applications.

• Equivalent

  There are no direct equivalent products for the S29GL01GS11DHIV20 chip. However, similar products that may be considered are other flash memory chips with similar specifications and features, such as the Samsung K9LAG08U0M or the Micron MT29F2G08ABAEAWP.

• Features

  The S29GL01GS11DHIV20 is a high-performance NOR Flash memory that offers a capacity of 1Gbit. It operates at a voltage range of 2.7V to 3.6V, has a fast access time of 90ns, and supports both asynchronous and synchronous interface options. It is designed for various applications requiring reliable and high-density memory solutions.

• Pinout

  The S29GL01GS11DHIV20 is a flash memory IC. It has a pin count of 48 pins in a TSOP package. The specific pin functions can vary depending on the configuration and application, but generally, the pins include power supply inputs, address and data inputs, control inputs, and output pins for data retrieval.

• Manufacturer

  The manufacturer of the S29GL01GS11DHIV20 is Cypress Semiconductor. Cypress Semiconductor is a global semiconductor manufacturing company that specializes in the design and development of high-performance integrated circuits and memory solutions for various industries, including automotive, consumer electronics, and industrial applications.

• Application Field

  The S29GL01GS11DHIV20 is a 1Gb NAND flash memory device. It is commonly used in applications such as automotive systems, industrial automation, networking equipment, and digital consumer electronics where high-density non-volatile memory is required for storage and data retention.

• Package

  The S29GL01GS11DHIV20 chip is a BGA (Ball Grid Array) package type with a form factor of 11mm x 12mm. Its size is classified as 0.4 mm pitch and contains 64 balls.