PC817XNNIP1B

Part points

• The PC817XNNIP1B is an optocoupler chip with a high current transfer ratio and 5000Vrms isolation voltage. It is commonly used in signal isolation, voltage regulation, and motor control applications due to its reliable performance and high-quality optical coupling properties.

• Equivalent

  Some equivalent products of the PC817XNNIP1B chip include TLP181, 4N25, MOC3021, SFH691, and PS2561. These chips are optocouplers or optoisolators with similar features and functions for various applications.

• Features

  1. Phototransistor output 2. High isolation voltage (5.3kVrms) 3. Mini-flat package design 4. High current transfer ratio (CTR) at low input currents 5. Operating temperature range of -55°C to +110°C 6. RoHS compliant and halogen-free 7. Suitable for high density mounting applications

• Pinout

  PC817XNNIP1B is an optocoupler with a 4-pin DIP package. It consists of an infrared LED and a phototransistor. The pinout is as follows: Pin 1 - Anode of the infrared LED, Pin 2 - Cathode of the infrared LED, Pin 3 - collector of the phototransistor, Pin 4 - emitter of the phototransistor.

• Manufacturer

  The manufacturer of PC817XNNIP1B is Sharp Corporation, a Japanese multinational corporation that designs and manufactures electronic products. Sharp Corporation is known for its innovation in electronic components, including display panels, sensors, and optoelectronics.

• Application Field

  The PC817XNNIP1B optocoupler is commonly used in high-speed isolation and signal transmission circuits for applications in automotive electronics, industrial control systems, communication equipment, and power supplies. It is used to provide electrical isolation between input and output circuits, ensuring safety and reliability in these systems.

• Package

  The PC817XNNIP1B chip is an optocoupler with a SOIC-4 package type, SMD/SMT form, and a size of 4.4 mm x 3.94 mm.