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Intel PC28F512M29EWL

NOR Flash Parallel 3V/3.3V 512M-bit 64M x 8/32M x 16 100ns 64-Pin Fortified BGA Tray

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: PC28F512M29EWL

Datasheet: PC28F512M29EWL Datasheet (PDF)

Package/Case: BGA064NOR

Product Type: Integrated Circuits (ICs)

RoHS Status:

Stock Condition: 2685 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for PC28F512M29EWL or email to us: Email: [email protected], we will contact you within 12 hours.

PC28F512M29EWL General Description

PC28F512M29EWL is a flash memory IC manufactured by Micron Technology. Here are some of its features:

pc28f512m29ewl

Features

  • It has a storage capacity of 512 megabits (64 megabytes).
  • It uses a NOR flash memory architecture.
  • It operates on a 2.7-3.6V power supply.
  • It has a page size of 2 kilobytes and a block size of 128 kilobytes.
  • It supports a high-speed, SPI-compatible serial interface for easy integration into embedded systems.

Application

  • Spansion S29GL512N
  • Macronix MX29GL512EH
  • Winbond W29N512AW
  • Samsung K9GAG08U0E
  • Toshiba TC58NVG0S3ETA00
Intel Corp Inventory

Specifications

Parameter Value Parameter Value
Pbfree Code Yes Rohs Code Yes
Part Life Cycle Code Obsolete Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA Package Description 11 X 13 MM, 1 MM PITCH, GREEN, BGA-64
Pin Count 64 Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.32.00.51
Access Time-Max 100 ns Alternate Memory Width 8
Command User Interface YES Common Flash Interface YES
Data Polling YES JESD-30 Code R-PBGA-B64
JESD-609 Code e1 Length 13 mm
Memory Density 536870912 bit Memory IC Type FLASH
Memory Width 16 Number of Functions 1
Number of Sectors/Size 512 Number of Terminals 64
Number of Words 33554432 words Number of Words Code 32000000
Operating Mode ASYNCHRONOUS Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C Organization 32MX16
Package Body Material PLASTIC/EPOXY Package Code LBGA
Package Equivalence Code BGA64,8X8,40 Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE Page Size 16/32 words
Parallel/Serial PARALLEL Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V Qualification Status Not Qualified
Ready/Busy YES Seated Height-Max 1.4 mm
Sector Size 128K Standby Current-Max 0.000225 A
Supply Current-Max 0.031 mA Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES Technology CMOS
Temperature Grade INDUSTRIAL Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL Terminal Pitch 1 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit YES Type NOR TYPE
Width 11 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The PC28F512M29EWL is a 512MB NOR flash memory chip with enhanced features such as on-die ECC, secure firmware updates, and advanced security features. It is commonly used in embedded systems, industrial applications, and automotive electronics for reliable, high-performance data storage and execution of code.
  • Equivalent

    Some equivalent products of PC28F512M29EWL chip are AT49F512-70TU, M29W512D, S29GL512P, and W29F512. These chips have similar specifications and functionality to the PC28F512M29EWL.
  • Features

    PC28F512M29EWL is a high-speed, low-power NOR flash memory with a capacity of 512Mb. It features a 2.5V/3.3V operation, fast random access times, high reliability, and a wide operating temperature range. It is ideal for use in automotive, industrial, and networking applications due to its robust design and advanced features.
  • Pinout

    The PC28F512M29EWL is a 48-pin flash memory chip with a capacity of 512Mbit. It functions as non-volatile storage for system firmware and data in embedded systems. It offers high speed and reliability for critical applications.
  • Manufacturer

    Intel is the manufacturer of the PC28F512M29EWL. It is an American multinational corporation and technology company that specializes in semiconductor manufacturing, including designs and builds processors, memory chips, integrated graphics, wireless solutions, and more for a variety of devices and applications.
  • Application Field

    - Industrial and automotive applications - Networking - Telecommunications - Server - Consumer electronics - Medical devices - Aerospace and defense - Security and surveillance systems
  • Package

    The PC28F512M29EWL chip is available in a 48-ball FGA package with a form factor of WFBGA. The size of the chip is 5x6mm, with a pitch of 0.5mm.

Datasheet PDF

Preliminary Specification PC28F512M29EWL PDF Download

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