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TI OPA2703UA

Operational Amplifiers - Op Amps 12V CMOS Rail-to-Rail I/O

ISO14001 ISO9001 DUNS

Brands: ti

Mfr.Part #: OPA2703UA

Datasheet: OPA2703UA Datasheet (PDF)

Package/Case: SOIC (D)-8

RoHS Status:

Stock Condition: 9588 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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OPA2703UA General Description

The OPA703 and OPA704 series op amps are optimized for applications requiring rail-to-rail input and output swing. Single, dual, and quad versions are offered in a variety of packages. While the quiescent current is less than 200uA per amplifier, the OPA703 still offers excellent dynamic performance (1MHz GBW and 0.6V/us SR) and unity-gain stability. The OPA704 is optimized for gains of 5 or greater and provides 3MHz GBW and 3V/us slew rate.

The OPA703 and OPA704 series are fully specified and guaranteed over the supply range of ±2V to ±6V. Input swing extends 300mV beyond the rail and the output swings to within 40mV of the rail.

The single versions (OPA703 and OPA704) are available in the MicroSIZE SOT23-5 and in the standard SO-8 surface-mount, as well as the DIP-8 packages. Dual versions (OPA2703 and OPA2704) are available in the MSOP-8, SO-8, and DIP-8 packages. The quad OPA4703 and OPA4704 are available in the TSSOP-14 and SO-14 packages. All are specified for operation from \x9640°C to +85°C.

OPA2703UA

Features

  • RAIL-TO-RAIL INPUT AND OUTPUT
  • WIDE SUPPLY RANGE:
    Single Supply: 4V to 12V
    Dual Supplies: ±2 to ±6
  • LOW QUIESCENT CURRENT: 160uA
  • FULL-SCALE CMRR: 90dB
  • LOW OFFSET: 160uV
  • HIGH SPEED:
    OPA703: 1MHz, 0.6V/us
    OPA704: 3MHz, 3V/us
  • MicroSIZE PACKAGES:
    SOT23-5, MSOP-8, TSSOP-14
  • LOW INPUT BIAS CURRENT: 1pA
  • APPLICATIONS
    • AUTOMOTIVE APPLICATIONS:
      Audio, Sensor Applications, Security Systems
    • PORTABLE EQUIPMENT
    • ACTIVE FILTERS
    • TRANSDUCER AMPLIFIER
    • TEST EQUIPMENT
    • DATA ACQUISITION

Specifications

Parameter Value Parameter Value
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 12
Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4 Rail-to-rail In, Out
GBW (typ) (MHz) 1 Slew rate (typ) (V/µs) 0.6
Vos (offset voltage at 25°C) (max) (mV) 0.75 Iq per channel (typ) (mA) 0.16
Vn at 1 kHz (typ) (nV√Hz) 45 Rating Catalog
Operating temperature range (°C) -40 to 85 Offset drift (typ) (µV/°C) 4
Features High Cload Drive Input bias current (max) (pA) 10
CMRR (typ) (dB) 90 Iout (typ) (A) 0.04
Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.3
Input common mode headroom (to positive supply) (typ) (V) 0.3 Output swing headroom (to negative supply) (typ) (V) 0.04
Output swing headroom (to positive supply) (typ) (V) -0.04

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The OPA2703UA chip is an operational amplifier (op-amp) manufactured by Texas Instruments. It is a dual-channel, low-noise, low-power op-amp suitable for a wide range of applications. The OPA2703UA provides high precision, a bandwidth of 30 MHz, and a low input voltage noise, making it ideal for use in audio and communication systems, instrumentation, medical equipment, and other applications requiring high-performance analog amplification.
  • Equivalent

    Some equivalent chips to OPA2703UA are OPA2703EA, OPA2703PA, OPA2703DA, and OPA2703SA.
  • Features

    The OPA2703UA is a dual operational amplifier with rail-to-rail input and output. It has a 5 MHz bandwidth, a low input offset voltage, and a low quiescent current, making it suitable for a wide range of precision applications. It also offers excellent noise performance and high output current capabilities.
  • Pinout

    The OPA2703UA is a dual operational amplifier. It has 8 pins, with each amplifier having an inverting input (pin 2), non-inverting input (pin 3), output (pin 1 and 6), and power supply connections (pins 7 and 4). The other pins serve as voltage references and are used for nulling the offset voltage.
  • Manufacturer

    Texas Instruments is the manufacturer of the OPA2703UA. It is a semiconductor and integrated circuits company based in the United States.
  • Application Field

    The OPA2703UA is a high-speed, low-noise operational amplifier (OP-Amp) commonly used in precision instrumentation, data acquisition systems, communication systems, and medical equipment. It can also be employed in audio applications, test and measurement equipment, and other electronic devices that require high-performance signal amplification and filtering.
  • Package

    The OPA2703UA chip is packaged in a SOIC (Small Outline Integrated Circuit) package type, which is a surface-mount package. It has a form factor of a rectangular shape with four sides and a notch on one end. The package size is typically 8.65mm x 3.91mm x 1.63mm.

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