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MT47H32M16HW-25E IT:G

SDRAM - DDR2 Memory IC 512Mbit Parallel 400 MHz 400 ps 84-FBGA (8x12.5)

ISO14001 ISO9001 DUNS

Brands: MICRON TECHNOLOGY INC

Mfr.Part #: MT47H32M16HW-25E IT:G

Datasheet: MT47H32M16HW-25E IT:G Datasheet (PDF)

Package/Case: 84-FBGA (8x12.5)

Product Type: DRAM

RoHS Status:

Stock Condition: 6554 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for MT47H32M16HW-25E IT:G or email to us: Email: [email protected], we will contact you within 12 hours.

MT47H32M16HW-25E IT:G General Description

SDRAM - DDR2 Memory IC 512Mbit Parallel 400 MHz 400 ps 84-FBGA (8x12.5)

Features

  • VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V
  • JEDEC-standard 1.8V I/O (SSTL_18-compatible)
  • Differential data strobe (DQS, DQS#) option
  • 4n-bit prefetch architecture
  • Duplicate output strobe (RDQS) option for x8
  • DLL to align DQ and DQS transitions with CK
  • 8 internal banks for concurrent operation
  • Programmable CAS latency (CL)
  • Posted CAS additive latency (AL)
  • WRITE latency = READ latency - 1 tCK
  • Selectable burst lengths (BL): 4 or 8
  • Adjustable data-output drive strength
  • 64ms, 8192-cycle refresh
  • On-die termination (ODT)
  • Industrial temperature (IT) option
  • Automotive temperature (AT) option
  • RoHS-compliant
  • Supports JEDEC clock jitter specification

Specifications

Parameter Value Parameter Value
Pbfree Code No Rohs Code No
Part Life Cycle Code Obsolete Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA Package Description 8 X 12.50 MM, FBGA-84
Pin Count 84 Reach Compliance Code not_compliant
ECCN Code EAR99 HTS Code 8542.32.00.28
Access Mode FOUR BANK PAGE BURST Access Time-Max 0.4 ns
Additional Feature AUTO/SELF REFRESH Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B84 JESD-609 Code e0
Length 12.5 mm Memory Density 536870912 bit
Memory IC Type DDR2 DRAM Memory Width 16
Number of Functions 1 Number of Ports 1
Number of Terminals 84 Number of Words 33554432 words
Number of Words Code 32000000 Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min -40 °C
Organization 32MX16 Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY Package Code TFBGA
Package Equivalence Code BGA84,9X15,32 Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH Peak Reflow Temperature (Cel) 235
Power Supplies 1.8 V Qualification Status Not Qualified
Refresh Cycles 8192 Seated Height-Max 1.2 mm
Self Refresh YES Sequential Burst Length 4,8
Standby Current-Max 0.007 A Supply Current-Max 0.215 mA
Supply Voltage-Max (Vsup) 1.9 V Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) Terminal Form BALL
Terminal Pitch 0.8 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • Features

    MT47H32M16HW-25E IT:G is a synchronous dynamic random-access memory (SDRAM) component. It has a capacity of 32 megabits (Mbit) and operates at a voltage of 1.8V. It is suitable for industrial temperature ranges (-40°C to +85°C) and offers high-speed data transfer and low power consumption.
  • Pinout

    The MT47H32M16HW-25E IT:G is a DDR3 SDRAM device with a 96-ball FBGA package. It has a pin count of 96 and is commonly used in memory modules for computer systems. The specific function of each pin can be found in the datasheet provided by the manufacturer.
  • Manufacturer

    The manufacturer of the MT47H32M16HW-25E IT:G is Micron Technology. Micron is a multinational company that specializes in the production and development of semiconductor devices, including memory chips. It is one of the leading companies in the memory and storage industry, offering a wide range of products for various applications like data centers, consumer electronics, and automotive technology.
  • Application Field

    The MT47H32M16HW-25E IT:G is a memory chip commonly used in various applications such as smartphones, tablets, gaming consoles, and other electronic devices that require high-speed and reliable data storage and retrieval. It offers a capacity of 32 megabits (4 megabytes) and operates at a speed of 25E (1600 MHz).
  • Package

    The MT47H32M16HW-25E IT:G chip is in an FBGA (Fine-Pitch Ball Grid Array) package type. It has a 162-ball form and a size of 12mm x 9mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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